Inventor
HUMMEL JOHN
US4 patents
⚠️ This page may combine multiple inventors who share the name “HUMMEL JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
3 patentsUS6255217B1Jul 3, 2001
Plasma treatment to enhance inorganic dielectric adhesion to copper
IBM78 citations94
US6743642B2Jun 1, 2004
Bilayer CMP process to improve surface roughness of magnetic stack in MRAM technology
IBM37 citations92
US6985384B2Jan 10, 2006
Spacer integration scheme in MRAM technology
IBM41 citations91