Inventor
LOW KIA-SENG
US13 patents
⚠️ This page may combine multiple inventors who share the name “LOW KIA-SENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
8 patentsUS6570256B2May 27, 2003
Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates
IBM85 citations96
US6743642B2Jun 1, 2004
Bilayer CMP process to improve surface roughness of magnetic stack in MRAM technology
IBM37 citations92
US6985384B2Jan 10, 2006
Spacer integration scheme in MRAM technology
IBM41 citations91
US6740539B2May 25, 2004
Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates
IBM37 citations91
US6884630B2Apr 26, 2005
Two-step magnetic tunnel junction stack deposition
IBM18 citations84
US7087438B2Aug 8, 2006
Encapsulation of conductive lines of semiconductor devices
IBM18 citations83
US7097777B2Aug 29, 2006
Magnetic switching device
IBM9 citations73
US6974770B2Dec 13, 2005
Self-aligned mask to reduce cell layout area
IBM10 citations73
INFINEON TECHNOLOGIES AG
5 patentsUS6858441B2Feb 22, 2005
MRAM MTJ stack to conductive line alignment method
INFINEON TECHNOLOGIES AG37 citations92
US6768150B1Jul 27, 2004
Magnetic memory
INFINEON TECHNOLOGIES AG26 citations91
US6846683B2Jan 25, 2005
Method of forming surface-smoothing layer for semiconductor devices with magnetic material layers
INFINEON TECHNOLOGIES AG14 citations83
US6680500B1Jan 20, 2004
Insulating cap layer and conductive cap layer for semiconductor devices with magnetic material layers
INFINEON TECHNOLOGIES AG18 citations83
US7125790B2Oct 24, 2006
Inclusion of low-k dielectric material between bit lines
INFINEON TECHNOLOGIES AG7 citations73