Inventor · disambiguated record
Karl Mautz
Also filed as: MAUTZ KARL · MAUTZ KARL E · MAUTZ KARL EMERSON
33 granted patents·6 pending applications·840 citations·filing 1986–2003
98Inventor score
Files withMOTOROLA INC29FREESCALE SEMICONDUCTOR INC4INFINEON TECHNOLOGIES AG1INFINEON TECHNOLOGIES SC3001
Top patents by PatentIndex Score
39 records- 0191US5982166AMethod for measuring a characteristic of a semiconductor wafer using cylindrical controlMOTOROLA INC·Filed 1997·Granted Nov 9, 1999·124 cites·45 claims
- 0290US6313567B1Lithography chuck having piezoelectric elements, and methodMOTOROLA INC·Filed 2000·Granted Nov 6, 2001·59 cites·23 claims
- 0390US4902377ASloped contact etch processMOTOROLA INC·Filed 1989·Granted Feb 20, 1990·106 cites·13 claims
- 0489US6650135B1Measurement chuck having piezoelectric elements and methodMOTOROLA INC·Filed 2000·Granted Nov 18, 2003·51 cites·17 claims
- 0586US6663340B1Wafer carrier transport system for tool baysMOTOROLA INC·Filed 2002·Granted Dec 16, 2003·45 cites·22 claims
- 0686US5904800ASemiconductor wafer processing chamber for reducing particles deposited onto the semiconductor waferMOTOROLA INC·Filed 1997·Granted May 18, 1999·49 cites·27 claims
- 0784US6420098B1Method and system for manufacturing semiconductor devices on a waferMOTOROLA INC·Filed 2000·Granted Jul 16, 2002·23 cites·7 claims
- 0883US5963315AMethod and apparatus for processing a semiconductor wafer on a robotic track having access to in situ wafer backside particle detectionMOTOROLA INC·Filed 1997·Granted Oct 5, 1999·69 cites·40 claims
- 0979US4698128ASloped contact etch processMOTOROLA INC·Filed 1986·Granted Oct 6, 1987·64 cites·22 claims
- 1075US6589099B2Method for chemical mechanical polishing (CMP) with altering the concentration of oxidizing agent in slurryMOTOROLA INC·Filed 2001·Granted Jul 8, 2003·19 cites·18 claims
- 1172US6737205B2Arrangement and method for transferring a pattern from a mask to a waferMOTOROLA INC·Filed 2002·Granted May 18, 2004·11 cites·18 claims
- 1271US6671059B2Method and system for determining a thickness of a layerMOTOROLA INC·Filed 2002·Granted Dec 30, 2003·12 cites·12 claims
- 1368US6686254B2Semiconductor structure and method for reducing charge damageMOTOROLA INC·Filed 2001·Granted Feb 3, 2004·14 cites·3 claims
- 1466US6902986B2Method for defining alignment marks in a semiconductor waferFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jun 7, 2005·9 cites·16 claims
- 1565US5476816AProcess for etching an insulating layer after a metal etching stepMOTOROLA INC·Filed 1994·Granted Dec 19, 1995·48 cites·21 claims
- 1664US6495802B1Temperature-controlled chuck and method for controlling the temperature of a substantially flat objectMOTOROLA INC·Filed 2001·Granted Dec 17, 2002·9 cites·13 claims
- 1763US5966635AMethod for reducing particles on a substrate using chuck cleaningMOTOROLA INC·Filed 1997·Granted Oct 12, 1999·30 cites·29 claims
- 1858US6881264B2Configuration and a method for reducing contamination with particles on a substrate in a process toolMOTOROLA INC·Filed 2003·Granted Apr 19, 2005·7 cites·11 claims
- 1958US6593254B2Method for clamping a semiconductor device in a manufacturing processINFINEON TECHNOLOGIES SC300·Filed 2002·Granted Jul 15, 2003·9 cites·9 claims
- 2058US6472237B1Method and system for determining a thickness of a layerMOTOROLA INC·Filed 2001·Granted Oct 29, 2002·5 cites·13 claims
- 2157US6914006B2Wafer scribing method and wafer scribing deviceFREESCALE SEMICONDUCTOR INC·Filed 2001·Granted Jul 5, 2005·6 cites·4 claims
- 2255US6895294B2Assembly comprising a plurality of mask containers, manufacturing system for manufacturing semiconductor devices, and methodINFINEON TECHNOLOGIES AG·Filed 2000·Granted May 17, 2005·6 cites·19 claims
- 2353US6801322B2Method and apparatus for IN SITU measuring a required feature of a layer during a polishing processFREESCALE SEMICONDUCTOR INC·Filed 2001·Granted Oct 5, 2004·5 cites·27 claims
- 2453US5945354AMethod for reducing particles deposited onto a semiconductor wafer during plasma processingMOTOROLA INC·Filed 1997·Granted Aug 31, 1999·18 cites·40 claims
- 2552US6759248B2Semiconductor wafer identificationMOTOROLA INC·Filed 2001·Granted Jul 6, 2004·6 cites·4 claims
- 2651US6620563B2Lithography method for forming semiconductor devices on a wafer utilizing atomic force microscopyMOTOROLA INC·Filed 2001·Granted Sep 16, 2003·3 cites·13 claims
- 2749US6892108B2Method for adjusting processing parameters of at least one plate-shaped object in a processing toolMOTOROLA INC·Filed 2003·Granted May 10, 2005·2 cites·9 claims
- 2848US6817602B2Manufacturing system method for processing a lithography mask containerFREESCALE SEMICONDUCTOR INC·Filed 2001·Granted Nov 16, 2004·2 cites·20 claims
- 2948US6744494B2Continuously adjustable neutral density area filterMOTOROLA INC·Filed 2001·Granted Jun 1, 2004·2 cites·8 claims
- 3046US6709312B2Method and apparatus for monitoring a polishing condition of a surface of a wafer in a polishing processMOTOROLA INC·Filed 2002·Granted Mar 23, 2004·2 cites·13 claims
- 3142US6362098B1Plasma-enhanced chemical vapor deposition (CVD) method to fill a trench in a semiconductor substrateMOTOROLA INC·Filed 2001·Granted Mar 26, 2002·2 cites·12 claims
- 3241US5250165AControlled isotropy reactive ion etcher for multi-stepped sloped contact etch processMOTOROLA INC·Filed 1991·Granted Oct 5, 1993·13 cites·10 claims
- 3339US2004031934A1System and method for monitoring ion implantation processingFiled 2002·Application pending·0 cites
- 3438US2003200996A1Method and system for cleaning a wafer chuckFiled 2002·Application pending·0 cites
- 3537US2002127865A1Lithography method for forming semiconductor devices with sub-micron structures on a wafer and apparatusMOTOROLA INC·Filed 2001·Application pending·0 cites
- 3635US2002127747A1Lithography method and apparatus with simplified reticlesMOTOROLA INC·Filed 2001·Application pending·0 cites
- 3733US2003082838A1Method and system for monitoring a semiconductor wafer plasma etch processFiled 2001·Application pending·0 cites
- 3831US5496438AMethod of removing photo resistMOTOROLA INC·Filed 1994·Granted Mar 5, 1996·10 cites·8 claims
- 3929US2003082857A1Method of processing a semiconductor wafer and preprocessed semiconductor waferFiled 2001·Application pending·0 cites
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