Inventor
LU HSIN-HSIEN
TW30 patents
⚠️ This page may combine multiple inventors who share the name “LU HSIN-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
20 patentsUS9415479B2Aug 16, 2016
Conductive chemical mechanical planarization polishing pad
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US10504753B2Dec 10, 2019
Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US9597771B2Mar 21, 2017
Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9434047B2Sep 6, 2016
Retainer ring
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US9576789B2Feb 21, 2017
Apparatus, method, and composition for far edge wafer cleaning
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US9601409B2Mar 21, 2017
Protruding contact for integrated chip
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations68
US11694909B2Jul 4, 2023
Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11458587B2Oct 4, 2022
Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9852899B2Dec 26, 2017
Wafer back-side polishing system and method for integrated circuit device manufacturing processes
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9559021B2Jan 31, 2017
Wafer back-side polishing system and method for integrated circuit device manufacturing processes
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9287127B2Mar 15, 2016
Wafer back-side polishing system and method for integrated circuit device manufacturing processes
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations62
US12495603B2Dec 9, 2025
Semiconductor device and manufacturing method for the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11594455B2Feb 28, 2023
Semiconductor device and manufacturing method for the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11705324B2Jul 18, 2023
Apparatus and method for wafer cleaning
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10998184B2May 4, 2021
Apparatus and method for wafer cleaning
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10734254B2Aug 4, 2020
Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10377013B2Aug 13, 2019
Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9466501B2Oct 11, 2016
Method and apparatus for improving CMP planarity
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US10325772B2Jun 18, 2019
Apparatus and method for wafer cleaning
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10770314B2Sep 8, 2020
Semiconductor device, tool, and method of manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations37
TAIWAN SEMICONDUCTOR MFG
8 patentsUS6962869B1Nov 8, 2005
SiOCH low k surface protection layer formation by CxHy gas plasma treatment
TAIWAN SEMICONDUCTOR MFG77 citations97
US6677251B1Jan 13, 2004
Method for forming a hydrophilic surface on low-k dielectric insulating layers for improved adhesion
TAIWAN SEMICONDUCTOR MFG108 citations96
US8828875B1Sep 9, 2014
Method and apparatus for improving CMP planarity
TAIWAN SEMICONDUCTOR MFG13 citations84
US6770570B2Aug 3, 2004
Method of forming a semiconductor device with a substantially uniform density low-k dielectric layer
TAIWAN SEMICONDUCTOR MFG13 citations84
US8921150B2Dec 30, 2014
Process to achieve contact protrusion for single damascene via
TAIWAN SEMICONDUCTOR MFG8 citations79
US8021566B2Sep 20, 2011
Method for pre-conditioning CMP polishing pad
TAIWAN SEMICONDUCTOR MFG6 citations73
US8348719B2Jan 8, 2013
Polisher for chemical mechanical planarization
TAIWAN SEMICONDUCTOR MFG2 citations63
US7105446B2Sep 12, 2006
Apparatus for pre-conditioning CMP polishing pad
TAIWAN SEMICONDUCTOR MFG0 citations51