Inventor
BAI YADONG
CN6 patents
⚠️ This page may combine multiple inventors who share the name “BAI YADONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HUAWEI TECH CO LTD
5 patentsUS9839167B2Dec 5, 2017
Electronic component package structure and electronic device
HUAWEI TECH CO LTD2 citations69
US9160244B2Oct 13, 2015
Magnetic integration double-ended converter
HUAWEI TECH CO LTD1 citations49
US10091915B2Oct 2, 2018
Electronic component package structure and electronic device
HUAWEI TECH CO LTD0 citations48
US11387226B2Jul 12, 2022
Chip power supply system, chip, PCB, and computer device
HUAWEI TECH CO LTD0 citations42
US9484311B2Nov 1, 2016
Chip package and packaging method
HUAWEI TECH CO LTD0 citations38