Inventor
KWON DAE HOON
KR24 patents
⚠️ This page may combine multiple inventors who share the name “KWON DAE HOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LG HAUSYS LTD
13 patentsUS9415417B2Aug 16, 2016
Scattered powder cleaning device capable of removing scattered powder from an internal space
LG HAUSYS LTD5 citations72
US9688572B2Jun 27, 2017
Low-emissivity coating and functional construction material for window and door including same
LG HAUSYS LTD4 citations70
US11105966B2Aug 31, 2021
Functional building material for windows and doors
LG HAUSYS LTD1 citations61
US10287208B2May 14, 2019
Functional building material for windows and doors
LG HAUSYS LTD1 citations61
US9505652B2Nov 29, 2016
Low-emissivity transparent laminate and building material containing the same
LG HAUSYS LTD2 citations60
US11161779B2Nov 2, 2021
Functional building material for windows
LG HAUSYS LTD0 citations51
US11046610B2Jun 29, 2021
Low-emissivity coating, and functional building material for windows and doors comprising low-emission coating
LG HAUSYS LTD0 citations51
US10132964B2Nov 20, 2018
Low-emissivity coating film, method for manufacturing same, and functional construction material for window and doors including same
LG HAUSYS LTD1 citations50
US9903154B2Feb 27, 2018
Low-emissivity coating film, method for manufacturing same, and functional construction material for window and doors including same
LG HAUSYS LTD1 citations50
US11345631B2May 31, 2022
Functional building material for door and window
LG HAUSYS LTD0 citations47
US11161780B2Nov 2, 2021
Functional building material for windows and doors
LG HAUSYS LTD0 citations47
US10415300B2Sep 17, 2019
Low-emissivity coating and functional construction material for window/door comprising low-emissivity coating
LG HAUSYS LTD0 citations41
US9284217B2Mar 15, 2016
Low-emissivity transparent laminated body and building material comprising same
LG HAUSYS LTD0 citations39
SAMSUNG ELECTRONICS CO LTD
7 patentsUS5965947AOct 12, 1999
Structure of a semiconductor package including chips bonded to die bonding pad with conductive adhesive and chips bonded with non-conductive adhesive containing insulating beads
SAMSUNG ELECTRONICS CO LTD95 citations97
US6903671B2Jun 7, 2005
Digital-to-analog converter with low skew and glitch
SAMSUNG ELECTRONICS CO LTD9 citations68
US7592845B2Sep 22, 2009
Input signal level detection apparatus and method
SAMSUNG ELECTRONICS CO LTD2 citations63
US7292094B2Nov 6, 2007
Gain control amplifier
SAMSUNG ELECTRONICS CO LTD4 citations62
US7177245B2Feb 13, 2007
Apparatus for generating tracking error signals
SAMSUNG ELECTRONICS CO LTD2 citations59
US7342854B2Mar 11, 2008
Apparatus for generating tracking error signals
SAMSUNG ELECTRONICS CO LTD0 citations48
US7471147B2Dec 30, 2008
Automatic gain controller
SAMSUNG ELECTRONICS CO LTD0 citations42