Inventor
KIRITANI HIDEKI
JP5 patents
Patents
5 patentsUS9508648B2Nov 29, 2016
Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminate
MITSUBISHI CHEM CORP6 citations81
US9847298B2Dec 19, 2017
Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminate
MITSUBISHI CHEM CORP3 citations70
US9822294B2Nov 21, 2017
Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition
MITSUBISHI CHEM CORP3 citations70
US10400151B2Sep 3, 2019
Agglomerated boron nitride particles, composition containing said particles, and three- dimensional integrated circuit having layer comprising said composition
MITSUBISHI CHEM CORP0 citations49
US10125289B2Nov 13, 2018
Composition for interlayer filler of layered semiconductor device, layered semiconductor device, and process for producing layered semiconductor device
MITSUBISHI CHEM CORP0 citations37