Inventor · disambiguated record
Yonggang Li
Also filed as: LI YONGGANG · LI YONGGANG YONG
52 granted patents·40 pending applications·224 citations·filing 2001–2024
98Inventor score
Top patents by PatentIndex Score
92 records- 0198US7237422B2Method of drawing a composite wireUNIV CENTRAL FLORIDA·Filed 2005·Granted Jul 3, 2007·22 cites·9 claims
- 0296US6732562B2Apparatus and method for drawing continuous fiberUNIV CENTRAL FLORIDA·Filed 2001·Granted May 11, 2004·33 cites·16 claims
- 0392US7749900B2Method and core materials for semiconductor packagingINTEL CORP·Filed 2008·Granted Jul 6, 2010·26 cites·8 claims
- 0491US10306760B2Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the methodINTEL CORP·Filed 2017·Granted May 28, 2019·6 cites·6 claims
- 0591US9000599B2Multichip integration with through silicon via (TSV) die embedded in packageRAORANE DIGVIJAY A·Filed 2013·Granted Apr 7, 2015·14 cites·13 claims
- 0691US7603883B2Method of drawing a ceramicUNIV CENTRAL FLORIDA·Filed 2007·Granted Oct 20, 2009·6 cites·6 claims
- 0790US8440916B2Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the methodLI YONGGANG·Filed 2007·Granted May 14, 2013·17 cites·23 claims
- 0889US7485017B2Pin grid array package substrate including pins having anchoring elementsINTEL CORP·Filed 2007·Granted Feb 3, 2009·20 cites·12 claims
- 0987US8928151B2Hybrid core through holes and viasINTEL CORP·Filed 2013·Granted Jan 6, 2015·7 cites·14 claims
- 1086US8552564B2Hybrid-core through holes and viasROY MIHIR K·Filed 2010·Granted Oct 8, 2013·7 cites·23 claims
- 1183US9716084B2Multichip integration with through silicon via (TSV) die embedded in packageINTEL CORP·Filed 2016·Granted Jul 25, 2017·3 cites·10 claims
- 1282US11081768B2Fabricating an RF filter on a semiconductor package using selective seedingINTEL CORP·Filed 2019·Granted Aug 3, 2021·2 cites·21 claims
- 1380US8227706B2Coaxial plated through holes (PTH) for robust electrical performanceROY MIHIR·Filed 2008·Granted Jul 24, 2012·12 cites·10 claims
- 1479US9648733B2Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the methodLI YONGGANG·Filed 2013·Granted May 9, 2017·3 cites·4 claims
- 1578US7013695B2Method for drawing continuous fiberQUICK NATHANIEL R·Filed 2004·Granted Mar 21, 2006·6 cites·4 claims
- 1677US7583871B1Substrates for optical die structuresBCHIR OMAR J·Filed 2008·Granted Sep 1, 2009·8 cites·23 claims
- 1777US7407878B2Method of providing solder bumps on a substrate using localized heatingINTEL CORP·Filed 2006·Granted Aug 5, 2008·7 cites·18 claims
- 1876US10539294B2Automobile exterior rear view mirror blind spot warning indication deviceSMR PATENTS SARL·Filed 2019·Granted Jan 21, 2020·3 cites·20 claims
- 1976US9554472B2Panel with releasable coreINTEL CORP·Filed 2014·Granted Jan 24, 2017·2 cites·25 claims
- 2074US2025125307A1Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2024·Application pending·0 cites
- 2173US8318536B2Utilizing aperture with phase shift feature in forming microviasLI YONGGANG·Filed 2007·Granted Nov 27, 2012·6 cites·12 claims
- 2272US12230430B2Substrate embedded magnetic core inductors and method of makingINTEL CORP·Filed 2022·Granted Feb 18, 2025·0 cites·9 claims
- 2370US2023146165A1Substrate embedded magnetic core inductors and method of makingINTEL CORP·Filed 2022·Application pending·0 cites
- 2469US9646854B2Embedded circuit patterning feature selective electroless copper platingINTEL CORP·Filed 2014·Granted May 9, 2017·2 cites·6 claims
- 2567US11605867B2Fabricating an RF filter on a semiconductor package using selective seedingINTEL CORP·Filed 2021·Granted Mar 14, 2023·0 cites·20 claims
- 2666US12412868B2Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·20 claims
- 2766US8456016B2Method and core materials for semiconductor packagingLI YONGGANG·Filed 2010·Granted Jun 4, 2013·1 cites·11 claims
- 2866US7923059B2Method of enabling selective area plating on a substrateINTEL CORP·Filed 2007·Granted Apr 12, 2011·2 cites·8 claims
- 2966US7891091B2Method of enabling selective area plating on a substrateLI YONGGANG·Filed 2008·Granted Feb 22, 2011·3 cites·20 claims
- 3065US9397079B2Multichip integration with through silicon via (TSV) die embedded in packageINTEL CORP·Filed 2015·Granted Jul 19, 2016·1 cites·10 claims
- 3164US12396613B2Steam cleaning apparatusSHARKNINJA OPERATING LLC·Filed 2022·Granted Aug 26, 2025·0 cites·14 claims
- 3264US12307982B2Method and device for driving a display panel and display deviceHEFEI VISIONOX TECH CO LTD·Filed 2024·Granted May 20, 2025·0 cites·16 claims
- 3363US9442286B2Spaced configuration of acousto-optic deflectors for laser beam scanning of a semiconductor substrateLI YONGGANG·Filed 2011·Granted Sep 13, 2016·1 cites·27 claims
- 3462US12345932B2Die last and waveguide last architecture for silicon photonic packagingINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·19 claims
- 3562US9113547B2Same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning(SAP)GUZEK JOHN·Filed 2008·Granted Aug 18, 2015·2 cites·7 claims
- 3662US8288682B2Forming micro-vias using a two stage laser drilling processSALAMA ISLAM·Filed 2007·Granted Oct 16, 2012·2 cites·18 claims
- 3761US2024344398A1Percussion and Cutting Composite Drilling ToolSICHUAN DEEPFAST OIL DRILLING TOOLS CO LTD·Filed 2024·Application pending·0 cites
- 3861US2025132239A1Porous liners for through-glass vias and associated methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 3959US2025391718A1Integrated circuit packages including substrates with reinforced glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 4057US11348718B2Substrate embedded magnetic core inductors and method of makingINTEL CORP·Filed 2018·Granted May 31, 2022·0 cites·15 claims
- 4157US9820390B2Process for forming a semiconductor device substrateINTEL CORP·Filed 2014·Granted Nov 14, 2017·0 cites·20 claims
- 4257US2024181572A1Dry method for metal-defined pad formationINTEL CORP·Filed 2022·Application pending·0 cites
- 4357US2023294204A1Method and apparatus for removing laser debond residue from substrateINTEL CORP·Filed 2022·Application pending·0 cites
- 4456US12354931B2Optimization for raster scanningINTEL CORP·Filed 2022·Granted Jul 8, 2025·0 cites·19 claims
- 4556US11923312B2Patternable die attach materials and processes for patterningINTEL CORP·Filed 2019·Granted Mar 5, 2024·0 cites·12 claims
- 4655US2025113434A1Through glass via (tgv) with modulated profile for core stress reductionINTEL CORP·Filed 2023·Application pending·0 cites
- 4755US2025192070A1Microelectronic assemblies with post-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 4854US2024219653A1Photonic alignment device and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 4953US10586715B2Embedded circuit patterning feature selective electrolessINTEL CORP·Filed 2017·Granted Mar 10, 2020·0 cites·11 claims
- 5053US2017202080A1Panel with releasable coreINTEL CORP·Filed 2017·Application pending·0 cites
Showing the top 50 of 92 patent records by PatentIndex Score.
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