Inventor
KIM JICHUL
KR24 patents
⚠️ This page may combine multiple inventors who share the name “KIM JICHUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
15 patentsUS10198049B2Feb 5, 2019
Surface temperature management method of mobile device and memory thermal management method of multichip package
SAMSUNG ELECTRONICS CO LTD9 citations83
US9671141B2Jun 6, 2017
Thermoelectric cooling packages and thermal management methods thereof
SAMSUNG ELECTRONICS CO LTD9 citations83
US11675392B2Jun 13, 2023
Electronic device including rollable display
SAMSUNG ELECTRONICS CO LTD5 citations72
US10658266B2May 19, 2020
Thermoelectric cooling packages and thermal management methods thereof
SAMSUNG ELECTRONICS CO LTD3 citations72
US10985152B2Apr 20, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations71
US10937771B2Mar 2, 2021
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD3 citations71
US10510737B2Dec 17, 2019
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US10347611B2Jul 9, 2019
Semiconductor packages having redistribution substrate
SAMSUNG ELECTRONICS CO LTD4 citations71
US9903764B2Feb 27, 2018
Integrated circuit for estimating power of at least one node using temperature and a system including the same
SAMSUNG ELECTRONICS CO LTD3 citations71
US9651431B2May 16, 2017
Semiconductor package and method of estimating surface temperature of semiconductor device including the same
SAMSUNG ELECTRONICS CO LTD2 citations68
US11600608B2Mar 7, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11832389B2Nov 28, 2023
Printed circuit module and electronic device including the same
SAMSUNG ELECTRONICS CO LTD1 citations57
US9679874B2Jun 13, 2017
Semiconductor package and semiconductor device including the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US12302495B2May 13, 2025
Interposer structure and an electronic device including the same
SAMSUNG ELECTRONICS CO LTD0 citations47
US12279371B2Apr 15, 2025
Printed circuit board assembly and electronic device comprising same
SAMSUNG ELECTRONICS CO LTD0 citations41