Inventor
Economy David Ross
US23 patents
⚠️ This page may combine multiple inventors who share the name “Economy David Ross”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
22 patentsUS11705500B2Jul 18, 2023
Assemblies having conductive structures with three or more different materials
MICRON TECHNOLOGY INC2 citations73
US10957775B2Mar 23, 2021
Assemblies having conductive structures with three or more different materials
MICRON TECHNOLOGY INC3 citations73
US11646206B2May 9, 2023
Methods of forming tungsten structures
MICRON TECHNOLOGY INC2 citations71
US11456208B2Sep 27, 2022
Methods of forming apparatuses including air gaps between conductive lines and related apparatuses, memory devices, and electronic systems
MICRON TECHNOLOGY INC5 citations71
US11158561B2Oct 26, 2021
Memory device with low density thermal barrier
MICRON TECHNOLOGY INC1 citations70
US9773807B1Sep 26, 2017
Conductive components and memory assemblies
MICRON TECHNOLOGY INC4 citations70
US12543559B2Feb 3, 2026
Memory device including control gates having tungsten structure
MICRON TECHNOLOGY INC0 citations62
US12087358B2Sep 10, 2024
Access line grain modulation in a memory device
MICRON TECHNOLOGY INC0 citations62
US10991425B2Apr 27, 2021
Access line grain modulation in a memory device
MICRON TECHNOLOGY INC0 citations62
US10916564B2Feb 9, 2021
Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillars
MICRON TECHNOLOGY INC0 citations62
US11721606B2Aug 8, 2023
Memory device with high resistivity thermal barrier
MICRON TECHNOLOGY INC0 citations61
US10964621B2Mar 30, 2021
Memory device with high resistivity thermal barrier
MICRON TECHNOLOGY INC0 citations61
US12593679B2Mar 31, 2026
Apparatuses and memory devices including air gaps between conductive lines
MICRON TECHNOLOGY INC0 citations60
US12431407B2Sep 30, 2025
Memory device with low density thermal barrier
MICRON TECHNOLOGY INC0 citations60
US11984382B2May 14, 2024
Memory device with low density thermal barrier
MICRON TECHNOLOGY INC0 citations60
US10014319B1Jul 3, 2018
Conductive components and memory assemblies
MICRON TECHNOLOGY INC1 citations60
US12022666B2Jun 25, 2024
Memory cell stack and via formation for a memory device
MICRON TECHNOLOGY INC0 citations55
US11189662B2Nov 30, 2021
Memory cell stack and via formation for a memory device
MICRON TECHNOLOGY INC1 citations55
US10700091B2Jun 30, 2020
Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillars
MICRON TECHNOLOGY INC0 citations52
US10355014B1Jul 16, 2019
Assemblies having vertically-extending structures
MICRON TECHNOLOGY INC0 citations52
US12322443B2Jun 3, 2025
Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells
MICRON TECHNOLOGY INC0 citations49
US10475810B2Nov 12, 2019
Conductive components and memory assemblies
MICRON TECHNOLOGY INC0 citations49