Inventor

TSUKUI Tomoya

JP4 patents

⚠️ This page may combine multiple inventors who share the name “TSUKUI Tomoya”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DENKA COMPANY LTD

2 patents

US9963622B2May 8, 2018

Heat-resistant adhesive sheet for semiconductor testing

DENKA COMPANY LTD3 citations68

US9934997B2Apr 3, 2018

Adhesive sheet and method of manufacturing electronic component

DENKA COMPANY LTD1 citations47

DISCO CORP

2 patents

US12312512B2May 27, 2025

Adhesive sheet for backgrinding and production method for semiconductor wafer

DISCO CORP0 citations49

US12243766B2Mar 4, 2025

Back grinding adhesive sheet, and method for manufacturing semiconductor wafer

DISCO CORP0 citations49