P

Inventor

WANG WENSHI

CN17 patents
⚠️ This page may combine multiple inventors who share the name “WANG WENSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHUHAI ACCESS SEMICONDUCTOR CO LTD

13 patents
US11114310B1Sep 7, 2021

Embedded packaging method capable of realizing heat dissipation

ZHUHAI ACCESS SEMICONDUCTOR CO LTD4 citations70
US11984414B2May 14, 2024

Packaging structure with antenna and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US12148676B2Nov 19, 2024

Embedded chip package and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations61
US11854920B2Dec 26, 2023

Embedded chip package and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations61
US11822121B2Nov 21, 2023

Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations60
US11579362B2Feb 14, 2023

Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations60
US11450619B2Sep 20, 2022

Embedded packaging structure having shielding cavity and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations60
US12412843B2Sep 9, 2025

Support frame structure and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations58
US12002734B2Jun 4, 2024

Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations58
US11569177B2Jan 31, 2023

Support frame structure and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations58
US12418988B2Sep 16, 2025

Inductor-integrating embedded support frame and substrate, and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations51
US11942465B2Mar 26, 2024

Embedded structure, manufacturing method thereof and substrate

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations50
US12463055B2Nov 4, 2025

Package substrate manufacturing method

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations48

H LEE MOFFITT CANCER CT & RES

2 patents

INST OF EXPLORATION TECHNIQUES CHINESE ACADEMY OF GEOLOGICAL SCIENCES

1 patent

NANTONG ACCESS SEMICONDUCTOR CO LTD

1 patent