Inventor
WANG WENSHI
CN17 patents
⚠️ This page may combine multiple inventors who share the name “WANG WENSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ZHUHAI ACCESS SEMICONDUCTOR CO LTD
13 patentsUS11114310B1Sep 7, 2021
Embedded packaging method capable of realizing heat dissipation
ZHUHAI ACCESS SEMICONDUCTOR CO LTD4 citations70
US11984414B2May 14, 2024
Packaging structure with antenna and manufacturing method thereof
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US12148676B2Nov 19, 2024
Embedded chip package and manufacturing method thereof
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations61
US11854920B2Dec 26, 2023
Embedded chip package and manufacturing method thereof
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations61
US11822121B2Nov 21, 2023
Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations60
US11579362B2Feb 14, 2023
Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations60
US11450619B2Sep 20, 2022
Embedded packaging structure having shielding cavity and manufacturing method thereof
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations60
US12412843B2Sep 9, 2025
Support frame structure and manufacturing method thereof
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations58
US12002734B2Jun 4, 2024
Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations58
US11569177B2Jan 31, 2023
Support frame structure and manufacturing method thereof
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations58
US12418988B2Sep 16, 2025
Inductor-integrating embedded support frame and substrate, and manufacturing method thereof
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations51
US11942465B2Mar 26, 2024
Embedded structure, manufacturing method thereof and substrate
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations50
US12463055B2Nov 4, 2025
Package substrate manufacturing method
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations48