Inventor
TREVITT DONNA J
US4 patents
Patents
4 patentsUS4448804AMay 15, 1984
Method for selective electroless plating of copper onto a non-conductive substrate surface
IBM80 citations94
US4554182ANov 19, 1985
Method for conditioning a surface of a dielectric substrate for electroless plating
IBM50 citations91
US4534797AAug 13, 1985
Method for providing an electroless copper plating bath in the take mode
IBM7 citations73
US4654126AMar 31, 1987
Process for determining the plating activity of an electroless plating bath
IBM14 citations72