P

Inventor

MORA LEONARD L

US7 patents
⚠️ This page may combine multiple inventors who share the name “MORA LEONARD L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LSI LOGIC CORP

4 patents
US6891260B1May 10, 2005

Integrated circuit package substrate with high density routing mechanism

LSI LOGIC CORP28 citations88
US6777802B1Aug 17, 2004

Integrated circuit package substrate with multiple voltage supplies

LSI LOGIC CORP18 citations76
US6479319B1Nov 12, 2002

Contact escape pattern

LSI LOGIC CORP11 citations72
US6748576B2Jun 8, 2004

Active trace rerouting

LSI LOGIC CORP0 citations45

VLSI TECHNOLOGY INC

2 patents
US5491362AFeb 13, 1996

Package structure having accessible chip

VLSI TECHNOLOGY INC62 citations94
US5539151AJul 23, 1996

Reinforced sealing technique for an integrated-circuit package

VLSI TECHNOLOGY INC17 citations81

LSI CORP

1 patent
US7750460B2Jul 6, 2010

Ball grid array package layout supporting many voltage splits and flexible split locations

LSI CORP2 citations60