Inventor
SHIMOMURA MARIKO
JP6 patents
Patents
6 patentsUS5643406AJul 1, 1997
Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus
TOSHIBA KK115 citations98
US5922620AJul 13, 1999
Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus
TOSHIBA KK51 citations95
US6069083AMay 30, 2000
Polishing method, semiconductor device fabrication method, and semiconductor fabrication apparatus
TOSHIBA KK19 citations92
US5968239AOct 19, 1999
Polishing slurry
TOSHIBA KK40 citations92
US5861054AJan 19, 1999
Polishing slurry
TOSHIBA KK40 citations92
US6098638AAug 8, 2000
Method of manufacturing a semiconductor device and an apparatus for manufacturing the same
TOSHIBA KK18 citations83