Inventor
WATTS DAVID K
US11 patents
⚠️ This page may combine multiple inventors who share the name “WATTS DAVID K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
5 patentsUS6001730ADec 14, 1999
Chemical mechanical polishing (CMP) slurry for polishing copper interconnects which use tantalum-based barrier layers
MOTOROLA INC324 citations98
US5985748ANov 16, 1999
Method of making a semiconductor device using chemical-mechanical polishing having a combination-step process
MOTOROLA INC98 citations95
US6096652AAug 1, 2000
Method of chemical mechanical planarization using copper coordinating ligands
MOTOROLA INC69 citations94
US6071816AJun 6, 2000
Method of chemical mechanical planarization using a water rinse to prevent particle contamination
MOTOROLA INC35 citations91
US6045435AApr 4, 2000
Low selectivity chemical mechanical polishing (CMP) process for use on integrated circuit metal interconnects
MOTOROLA INC44 citations89
IBM
4 patentsUS7544609B2Jun 9, 2009
Method for integrating liner formation in back end of line processing
IBM9 citations84
US7820051B2Oct 26, 2010
Recycling of electrochemical-mechanical planarization (ECMP) slurries/electrolytes
IBM4 citations61
US7883395B2Feb 8, 2011
Electrical contact structures and methods for use
IBM0 citations51
US7807036B2Oct 5, 2010
Method and system for pad conditioning in an ECMP process
IBM1 citations51