Inventor
GAYNES MICHAEL ANTHONY
US44 patents
⚠️ This page may combine multiple inventors who share the name “GAYNES MICHAEL ANTHONY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
42 patentsUS6165885ADec 26, 2000
Method of making components with solder balls
IBM265 citations99
US6236115B1May 22, 2001
High density integrated circuit packaging with chip stacking and via interconnections
IBM342 citations98
US6187678B1Feb 13, 2001
High density integrated circuit packaging with chip stacking and via interconnections
IBM274 citations98
US6002177ADec 14, 1999
High density integrated circuit packaging with chip stacking and via interconnections
IBM408 citations98
US6069023AMay 30, 2000
Attaching heat sinks directly to flip chips and ceramic chip carriers
IBM115 citations97
US5847929ADec 8, 1998
Attaching heat sinks directly to flip chips and ceramic chip carriers
IBM164 citations97
US5744863AApr 28, 1998
Chip carrier modules with heat sinks attached by flexible-epoxy
IBM243 citations97
US5672548ASep 30, 1997
Method for attaching heat sinks directly to chip carrier modules using flexible-epoxy
IBM191 citations97
US6111323AAug 29, 2000
Reworkable thermoplastic encapsulant
IBM76 citations96
US6150726ANov 21, 2000
Component carrier with raised bonding sites
IBM51 citations95
US5759737AJun 2, 1998
Method of making a component carrier
IBM62 citations95
US6740959B2May 25, 2004
EMI shielding for semiconductor chip carriers
IBM97 citations94
US6251707B1Jun 26, 2001
Attaching heat sinks directly to flip chips and ceramic chip carriers
IBM63 citations94
US5813870ASep 29, 1998
Selectively filled adhesives for semiconductor chip interconnection and encapsulation
IBM55 citations94
US5785799AJul 28, 1998
Apparatus for attaching heat sinks directly to chip carrier modules using flexible epoxy
IBM65 citations94
US7808781B2Oct 5, 2010
Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements
IBM47 citations93
US6974915B2Dec 13, 2005
Printed wiring board interposer sub-assembly and method
IBM16 citations93
US6695623B2Feb 24, 2004
Enhanced electrical/mechanical connection for electronic devices
IBM54 citations93
US6545226B2Apr 8, 2003
Printed wiring board interposer sub-assembly
IBM28 citations93
US6252779B1Jun 26, 2001
Ball grid array via structure
IBM33 citations93
US6197222B1Mar 6, 2001
Lead free conductive composites for electrical interconnections
IBM22 citations92
US5866044AFeb 2, 1999
Lead free conductive composites for electrical interconnections
IBM32 citations92
US5713508AFeb 3, 1998
Stabilization of conductive adhesive by metallurgical bonding
IBM29 citations92
US6403882B1Jun 11, 2002
Protective cover plate for flip chip assembly backside
IBM34 citations91
US5875011AFeb 23, 1999
Liquid crystal display tile interconnected to a tile carrier and method
IBM24 citations89
US6512295B2Jan 28, 2003
Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses
IBM15 citations84
US6892451B2May 17, 2005
Method of making an interposer sub-assembly in a printed wiring board
IBM10 citations74
US6670223B2Dec 30, 2003
Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses
IBM10 citations74
US6531343B1Mar 11, 2003
Method of encapsulating a circuit assembly
IBM5 citations74
US6495771B2Dec 17, 2002
Compliant multi-layered circuit board for PBGA applications
IBM9 citations74
US6326237B1Dec 4, 2001
Reworkable thermoplastic hyper-branched encapsulant
IBM6 citations74
US5998876ADec 7, 1999
Reworkable thermoplastic hyper-branched encapsulant
IBM13 citations74
US6492724B2Dec 10, 2002
Structure for reinforcing a semiconductor device to prevent cracking
IBM8 citations73
US6197619B1Mar 6, 2001
Method for reinforcing a semiconductor device to prevent cracking
IBM10 citations73
US10607963B2Mar 31, 2020
Chip package for two-phase cooling and assembly process thereof
IBM3 citations72
US6617698B2Sep 9, 2003
Reworkable and thermally conductive adhesive and use thereof
IBM11 citations72
US6255208B1Jul 3, 2001
Selective wafer-level testing and burn-in
IBM10 citations72
US5777705AJul 7, 1998
Wire bond attachment of a liquid crystal display tile to a tile carrier
IBM15 citations71
US9852960B2Dec 26, 2017
Underfill dispensing using funnels
IBM2 citations70
US6777817B2Aug 17, 2004
Reworkable and thermally conductive adhesive and use thereof
IBM2 citations61
US10249516B2Apr 2, 2019
Underfill dispensing using funnels
IBM1 citations60
US7504718B2Mar 17, 2009
Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain
IBM6 citations57