Inventor
MEHTA VIPUL V
US8 patents
⚠️ This page may combine multiple inventors who share the name “MEHTA VIPUL V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
7 patentsUS11158558B2Oct 26, 2021
Package with underfill containment barrier
INTEL CORP5 citations82
US11664290B2May 30, 2023
Package with underfill containment barrier
INTEL CORP3 citations71
US10403578B2Sep 3, 2019
Electronic device package
INTEL CORP3 citations71
US10373888B2Aug 6, 2019
Electronic package assembly with compact die placement
INTEL CORP3 citations71
US12327773B2Jun 10, 2025
Package with underfill containment barrier
INTEL CORP0 citations61
US11935805B2Mar 19, 2024
Package with underfill containment barrier
INTEL CORP0 citations61
US10290592B2May 14, 2019
Semiconductor package, and a method for forming a semiconductor package
INTEL CORP0 citations49