Inventor
VADLAMANI SAI
US38 patents
Patents
38 patentsUS11158558B2Oct 26, 2021
Package with underfill containment barrier
INTEL CORP5 citations82
US11557489B2Jan 17, 2023
Cavity structures in integrated circuit package supports
INTEL CORP2 citations73
US10643994B2May 5, 2020
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
INTEL CORP2 citations73
US10373951B1Aug 6, 2019
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
INTEL CORP4 citations73
US11189409B2Nov 30, 2021
Electronic substrates having embedded dielectric magnetic material to form inductors
INTEL CORP2 citations72
US10700021B2Jun 30, 2020
Coreless organic packages with embedded die and magnetic inductor structures
INTEL CORP3 citations72
US11664290B2May 30, 2023
Package with underfill containment barrier
INTEL CORP3 citations71
US11552008B2Jan 10, 2023
Asymmetric cored integrated circuit package supports
INTEL CORP3 citations71
US10741947B2Aug 11, 2020
Plated through hole socketing coupled to a solder ball to engage with a pin
INTEL CORP2 citations71
US11251113B2Feb 15, 2022
Methods of embedding magnetic structures in substrates
INTEL CORP2 citations70
US12555714B2Feb 17, 2026
Device, method, and system to provide passivation structures of a magnetic material based inductor
INTEL CORP0 citations62
US12481108B2Nov 25, 2025
Faraday rotator interconnect as a through-via configuration in a patch architecture
INTEL CORP0 citations62
US12327814B2Jun 10, 2025
Electronic substrate core having an embedded laser stop to control depth of an ultra-deep cavity
INTEL CORP0 citations62
US12154715B2Nov 26, 2024
Methods to selectively embed magnetic materials in substrate and corresponding structures
INTEL CORP0 citations62
US11901115B2Feb 13, 2024
Substrate assembly with encapsulated magnetic feature
INTEL CORP0 citations62
US11881463B2Jan 23, 2024
Coreless organic packages with embedded die and magnetic inductor structures
INTEL CORP0 citations62
US11735537B2Aug 22, 2023
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures
INTEL CORP0 citations62
US11610706B2Mar 21, 2023
Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates
INTEL CORP0 citations62
US11450471B2Sep 20, 2022
Methods to selectively embed magnetic materials in substrate and corresponding structures
INTEL CORP0 citations62
US11443892B2Sep 13, 2022
Substrate assembly with encapsulated magnetic feature
INTEL CORP1 citations62
US11417614B2Aug 16, 2022
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures
INTEL CORP0 citations62
US11355459B2Jun 7, 2022
Embedding magnetic material, in a cored or coreless semiconductor package
INTEL CORP0 citations62
US11335632B2May 17, 2022
Magnetic inductor structures for package devices
INTEL CORP1 citations62
US11244912B2Feb 8, 2022
Semiconductor package having a coaxial first layer interconnect
INTEL CORP0 citations62
US11205626B2Dec 21, 2021
Coreless organic packages with embedded die and magnetic inductor structures
INTEL CORP0 citations62
US10971492B2Apr 6, 2021
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
INTEL CORP0 citations62
US12327773B2Jun 10, 2025
Package with underfill containment barrier
INTEL CORP0 citations61
US11935805B2Mar 19, 2024
Package with underfill containment barrier
INTEL CORP0 citations61
US11289263B2Mar 29, 2022
Electronic substrates having embedded magnetic material using photo-imagable dielectric layers
INTEL CORP0 citations61
US12599050B2Apr 7, 2026
Multi-level die coupled with a substrate
INTEL CORP0 citations60
US11862552B2Jan 2, 2024
Methods of embedding magnetic structures in substrates
INTEL CORP0 citations60
US11651902B2May 16, 2023
Patterning of thin film capacitors in organic substrate packages
INTEL CORP0 citations59
US12573536B2Mar 10, 2026
Electronic substrates having embedded inductors
INTEL CORP0 citations58
US12057252B2Aug 6, 2024
Electronic substrates having embedded inductors
INTEL CORP0 citations58
US10692965B2Jun 23, 2020
3D conductive ink printing method and inductor formed thereof
INTEL CORP0 citations52
US10672859B2Jun 2, 2020
Embedded magnetic inductor
INTEL CORP0 citations52
US12517314B2Jan 6, 2026
High bandwidth optical interconnection architectures
INTEL CORP0 citations50
US12327797B2Jun 10, 2025
Microelectronic structures including glass cores
INTEL CORP0 citations50