Inventor
LU SIQING
US26 patents
⚠️ This page may combine multiple inventors who share the name “LU SIQING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
21 patentsUS6660126B2Dec 9, 2003
Lid assembly for a processing system to facilitate sequential deposition techniques
APPLIED MATERIALS INC128 citations98
US6461435B1Oct 8, 2002
Showerhead with reduced contact area
APPLIED MATERIALS INC600 citations98
US6734020B2May 11, 2004
Valve control system for atomic layer deposition chamber
APPLIED MATERIALS INC135 citations97
USD1038049SAug 6, 2024
Cover ring for use in semiconductor processing chamber
APPLIED MATERIALS INC21 citations92
US7510624B2Mar 31, 2009
Self-cooling gas delivery apparatus under high vacuum for high density plasma applications
APPLIED MATERIALS INC21 citations92
US7112961B2Sep 26, 2006
Method and apparatus for dynamically measuring the thickness of an object
APPLIED MATERIALS INC18 citations91
US7722719B2May 25, 2010
Gas baffle and distributor for semiconductor processing chamber
APPLIED MATERIALS INC22 citations90
US7201803B2Apr 10, 2007
Valve control system for atomic layer deposition chamber
APPLIED MATERIALS INC21 citations90
US7799704B2Sep 21, 2010
Gas baffle and distributor for semiconductor processing chamber
APPLIED MATERIALS INC15 citations84
US7789993B2Sep 7, 2010
Internal balanced coil for inductively coupled high density plasma processing chamber
APPLIED MATERIALS INC8 citations84
US7740706B2Jun 22, 2010
Gas baffle and distributor for semiconductor processing chamber
APPLIED MATERIALS INC19 citations84
US7572647B2Aug 11, 2009
Internal balanced coil for inductively coupled high density plasma processing chamber
APPLIED MATERIALS INC10 citations84
US7651587B2Jan 26, 2010
Two-piece dome with separate RF coils for inductively coupled plasma reactors
APPLIED MATERIALS INC8 citations82
US7355394B2Apr 8, 2008
Apparatus and method of dynamically measuring thickness of a layer of a substrate
APPLIED MATERIALS INC9 citations80
US11996315B2May 28, 2024
Thin substrate handling via edge clamping
APPLIED MATERIALS INC2 citations71
US9685655B2Jun 20, 2017
Complex showerhead coating apparatus with electrospray for lithium ion battery
APPLIED MATERIALS INC2 citations69
US12100579B2Sep 24, 2024
Deposition ring for thin substrate handling via edge clamping
APPLIED MATERIALS INC0 citations61
US7811411B2Oct 12, 2010
Thermal management of inductively coupled plasma reactors
APPLIED MATERIALS INC2 citations61
US7777483B2Aug 17, 2010
Method and apparatus for measuring a thickness of a layer of a wafer
APPLIED MATERIALS INC3 citations61
US11881375B2Jan 23, 2024
Common substrate and shadow ring lift apparatus
APPLIED MATERIALS INC0 citations60
US12400833B2Aug 26, 2025
Methods and apparatus for processing a substrate
APPLIED MATERIALS INC0 citations48
SAMSUNG ELECTRONICS CO LTD
5 patentsUS11538697B2Dec 27, 2022
Substrate processing apparatus
SAMSUNG ELECTRONICS CO LTD2 citations71
US11728198B2Aug 15, 2023
Electrostatic chuck and wafer etching device including the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US10529618B2Jan 7, 2020
Methods of manufacturing a semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations62
US11244839B2Feb 8, 2022
Plasma processing apparatus
SAMSUNG ELECTRONICS CO LTD1 citations59
US12106945B2Oct 1, 2024
Plasma processing apparatus and method of manufacturing semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations49