Inventor
MU CHUN
US5 patents
Patents
5 patentsUS7189596B1Mar 13, 2007
Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structures
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US6825063B2Nov 30, 2004
Integrated core microelectronic package
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US6743664B2Jun 1, 2004
Flip-chip on flex for high performance packaging applications
INTEL CORP45 citations95
US6238954B1May 29, 2001
COF packaged semiconductor
INTEL CORP17 citations91
US6737754B2May 18, 2004
COF packaged semiconductor
INTEL CORP5 citations61