Inventor
TAGGART BRIAN
US9 patents
⚠️ This page may combine multiple inventors who share the name “TAGGART BRIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
8 patentsUS7304373B2Dec 4, 2007
Power distribution within a folded flex package method and apparatus
INTEL CORP83 citations96
US7375978B2May 20, 2008
Method and apparatus for trace shielding and routing on a substrate
INTEL CORP23 citations90
US7190068B2Mar 13, 2007
Bottom heat spreader
INTEL CORP19 citations90
US7358444B2Apr 15, 2008
Folded substrate with interposer package for integrated circuit devices
INTEL CORP34 citations89
US7250684B2Jul 31, 2007
Circular wire-bond pad, package made therewith, and method of assembling same
INTEL CORP14 citations82
US7372133B2May 13, 2008
Microelectronic package having a stiffening element and method of making same
INTEL CORP9 citations80
US7302756B2Dec 4, 2007
Bond finger on via substrate, process of making same, package made thereby, and method of assembling same
INTEL CORP2 citations60
US7818878B2Oct 26, 2010
Integrated circuit device mounting with folded substrate and interposer
INTEL CORP0 citations48