Inventor
SPREITZER RONALD L
US6 patents
Patents
6 patentsUS7304373B2Dec 4, 2007
Power distribution within a folded flex package method and apparatus
INTEL CORP83 citations96
US7358444B2Apr 15, 2008
Folded substrate with interposer package for integrated circuit devices
INTEL CORP34 citations89
US7302756B2Dec 4, 2007
Bond finger on via substrate, process of making same, package made thereby, and method of assembling same
INTEL CORP2 citations60
US12481035B2Nov 25, 2025
Silicon photonic systems for LIDAR applications
INTEL CORP1 citations55
US7818878B2Oct 26, 2010
Integrated circuit device mounting with folded substrate and interposer
INTEL CORP0 citations48
US12581996B2Mar 17, 2026
Interposer interconnects and enclosure for silicon photonics LIDAR module
INTEL CORP0 citations46