Inventor
CHAFIN MICHAEL G
US15 patents
⚠️ This page may combine multiple inventors who share the name “CHAFIN MICHAEL G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
13 patentsUS6095084AAug 1, 2000
High density plasma process chamber
APPLIED MATERIALS INC250 citations99
US5903428AMay 11, 1999
Hybrid Johnsen-Rahbek electrostatic chuck having highly resistive mesas separating the chuck from a wafer supported thereupon and method of fabricating same
APPLIED MATERIALS INC300 citations98
US6151203ANov 21, 2000
Connectors for an electrostatic chuck and combination thereof
APPLIED MATERIALS INC76 citations95
US5636098AJun 3, 1997
Barrier seal for electrostatic chuck
APPLIED MATERIALS INC85 citations94
US6273958B2Aug 14, 2001
Substrate support for plasma processing
APPLIED MATERIALS INC20 citations92
US7813103B2Oct 12, 2010
Time-based wafer de-chucking from an electrostatic chuck having separate RF BIAS and DC chucking electrodes
APPLIED MATERIALS INC14 citations84
US7838430B2Nov 23, 2010
Plasma control using dual cathode frequency mixing
APPLIED MATERIALS INC8 citations83
US6824748B2Nov 30, 2004
Heated catalytic treatment of an effluent gas from a substrate fabrication process
APPLIED MATERIALS INC18 citations83
US10840062B2Nov 17, 2020
Radio frequency filter system for a processing chamber
APPLIED MATERIALS INC9 citations82
US11447868B2Sep 20, 2022
Method for controlling a plasma process
APPLIED MATERIALS INC2 citations72
US10546731B1Jan 28, 2020
Method, apparatus and system for wafer dechucking using dynamic voltage sweeping
APPLIED MATERIALS INC1 citations61
US9601301B2Mar 21, 2017
Non-intrusive measurement of a wafer DC self-bias in semiconductor processing equipment
APPLIED MATERIALS INC1 citations51
US9070536B2Jun 30, 2015
Plasma reactor electrostatic chuck with cooled process ring and heated workpiece support surface
APPLIED MATERIALS INC0 citations36