Inventor
CHEN CHIH-HAO
TW195 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHIH-HAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
20 patentsUS10559492B2Feb 11, 2020
Patterning methods for semiconductor devices and structures resulting therefrom
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations94
US9679804B1Jun 13, 2017
Multi-patterning to form vias with straight profiles
TAIWAN SEMICONDUCTOR MFG CO LTD19 citations92
US11626344B2Apr 11, 2023
Adhesive and thermal interface material on a plurality of dies covered by a lid
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations86
US11239136B1Feb 1, 2022
Adhesive and thermal interface material on a plurality of dies covered by a lid
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations86
US10347506B2Jul 9, 2019
Multiple patterning method using mask portions to etch semiconductor substrate
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US9659821B1May 23, 2017
Method of forming interconnect structures by self-aligned approach
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US10861705B2Dec 8, 2020
Reduction of line wiggling
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations82
US10079178B1Sep 18, 2018
Formation method of semiconductor device structure using multilayer resist layer
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations82
US11996345B2May 28, 2024
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations74
US11626368B2Apr 11, 2023
Semiconductor device having fuse array and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations74
US12170236B2Dec 17, 2024
Method for forming package structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11830821B2Nov 28, 2023
Semiconductor devices and methods of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11804468B2Oct 31, 2023
Manufacturing method of semiconductor package using jig
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11348829B2May 31, 2022
Patterning methods for semiconductor devices and structures resulting therefrom
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11239134B2Feb 1, 2022
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11062968B2Jul 13, 2021
Package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11049763B2Jun 29, 2021
Multi-patterning to form vias with straight profiles
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10852476B2Dec 1, 2020
Semiconductor package, integrated optical communication system and manufacturing method of integrated optical communication system
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10840131B2Nov 17, 2020
Patterning methods for semiconductor devices and structures resulting therefrom
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10163688B2Dec 25, 2018
Interconnect structure with kinked profile
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
EPISTAR CORP
3 patentsINTEL CORP
2 patentsVIVOTEK INC
2 patentsDELL PRODUCTS LP
2 patentsCHEN CHIH-HAO
2 patentsTAIWAN SEMICONDUCTOR MFG
2 patentsCHICONY ELECTRONICS CO LTD
2 patentsUPI SEMICONDUCTOR CORP
2 patentsACER INC
1 patentAMAZING MICROELECTRONIC CORP
1 patentAU OPTRONICS CORP
1 patentCHANG CHIA-LAN
1 patentCHIMEI INNOLUX CORP
1 patentZIPPY TECH CORP
1 patentKO CHUNG-CHI
1 patentSHIH PO-CHENG
1 patentCHEN CHII-PING
1 patentLIANG MING-CHUNG
1 patentELITE SEMICONDUCTOR MICROELECTRONICS TECHNOLOGY INC
1 patentELITE SEMICONDUCTOR MEMORY TECH INC
1 patentUBIQ SEMICONDUCTOR CORP
1 patentShowing the top 50 of 195 patents by PatentIndex Score.