P

Inventor

CHEN CHIH-HAO

TW195 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHIH-HAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

20 patents
US10559492B2Feb 11, 2020

Patterning methods for semiconductor devices and structures resulting therefrom

TAIWAN SEMICONDUCTOR MFG CO LTD12 citations94
US9679804B1Jun 13, 2017

Multi-patterning to form vias with straight profiles

TAIWAN SEMICONDUCTOR MFG CO LTD19 citations92
US11626344B2Apr 11, 2023

Adhesive and thermal interface material on a plurality of dies covered by a lid

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations86
US11239136B1Feb 1, 2022

Adhesive and thermal interface material on a plurality of dies covered by a lid

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations86
US10347506B2Jul 9, 2019

Multiple patterning method using mask portions to etch semiconductor substrate

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US9659821B1May 23, 2017

Method of forming interconnect structures by self-aligned approach

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US10861705B2Dec 8, 2020

Reduction of line wiggling

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations82
US10079178B1Sep 18, 2018

Formation method of semiconductor device structure using multilayer resist layer

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations82
US11996345B2May 28, 2024

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations74
US11626368B2Apr 11, 2023

Semiconductor device having fuse array and method of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations74
US12170236B2Dec 17, 2024

Method for forming package structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11830821B2Nov 28, 2023

Semiconductor devices and methods of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11804468B2Oct 31, 2023

Manufacturing method of semiconductor package using jig

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11348829B2May 31, 2022

Patterning methods for semiconductor devices and structures resulting therefrom

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11239134B2Feb 1, 2022

Package structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11062968B2Jul 13, 2021

Package structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11049763B2Jun 29, 2021

Multi-patterning to form vias with straight profiles

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10852476B2Dec 1, 2020

Semiconductor package, integrated optical communication system and manufacturing method of integrated optical communication system

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10840131B2Nov 17, 2020

Patterning methods for semiconductor devices and structures resulting therefrom

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10163688B2Dec 25, 2018

Interconnect structure with kinked profile

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73

EPISTAR CORP

3 patents

INTEL CORP

2 patents

VIVOTEK INC

2 patents

DELL PRODUCTS LP

2 patents

CHEN CHIH-HAO

2 patents

TAIWAN SEMICONDUCTOR MFG

2 patents

CHICONY ELECTRONICS CO LTD

2 patents

UPI SEMICONDUCTOR CORP

2 patents

ACER INC

1 patent

AMAZING MICROELECTRONIC CORP

1 patent

AU OPTRONICS CORP

1 patent

CHANG CHIA-LAN

1 patent

CHIMEI INNOLUX CORP

1 patent

ZIPPY TECH CORP

1 patent

KO CHUNG-CHI

1 patent

SHIH PO-CHENG

1 patent

CHEN CHII-PING

1 patent

LIANG MING-CHUNG

1 patent

ELITE SEMICONDUCTOR MICROELECTRONICS TECHNOLOGY INC

1 patent

ELITE SEMICONDUCTOR MEMORY TECH INC

1 patent

UBIQ SEMICONDUCTOR CORP

1 patent

Showing the top 50 of 195 patents by PatentIndex Score.