Inventor

LEE MENG-HAN

TW4 patents

⚠️ This page may combine multiple inventors who share the name “LEE MENG-HAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE MENG-HAN

2 patents

US8450624B2May 28, 2013

Supporting substrate and method for fabricating the same

LEE MENG-HAN0 citations36

US8058567B2Nov 15, 2011

High density package substrate and method for fabricating the same

LEE MENG-HAN0 citations33

WANG TZU-YU

1 patent

US8878182B2Nov 4, 2014

Probe pad design for 3DIC package yield analysis

WANG TZU-YU1 citations50

NAN YA PRINTED CIRCUIT BOARD

1 patent

US7877873B2Feb 1, 2011

Method for forming a wire bonding substrate

NAN YA PRINTED CIRCUIT BOARD0 citations27