Inventor
ISHIDO KIMINORI
JP15 patents
⚠️ This page may combine multiple inventors who share the name “ISHIDO KIMINORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
6 patentsUS5258094ANov 2, 1993
Method for producing multilayer printed wiring boards
NEC CORP292 citations96
US5658611AAug 19, 1997
Surface protection material for printed circuit board and process of forming surface protection films
NEC CORP23 citations92
US5458907AOct 17, 1995
Method of manufacturing printed circuit boards having an oxidation proof coating on a copper or copper alloy circuit pattern
NEC CORP24 citations92
US5746813AMay 5, 1998
Surface protection material for printed circuit board and process of forming surface protection films
NEC CORP10 citations73
US5324535AJun 28, 1994
Process of coating printed wiring board with solid solder resist pattern formed from liquid and dry solder resist films
NEC CORP6 citations62
US5464725ANov 7, 1995
Method of manufacturing a printed wiring board
NEC CORP1 citations52
J DEVICES CORP
3 patentsJ-DEVICES CORP
3 patentsUS9635762B2Apr 25, 2017
Semiconductor package
J-DEVICES CORP6 citations71
US9553052B2Jan 24, 2017
Magnetic shielding package of non-volatile magnetic memory element
J-DEVICES CORP4 citations71
US9685376B2Jun 20, 2017
Semiconductor device and method of manufacturing semiconductor device
J-DEVICES CORP0 citations39