Inventor
EUGENE LEE LEE HAN MENG@
MY17 patents
Patents
17 patentsUS9515009B2Dec 6, 2016
Packaged semiconductor device having leadframe features preventing delamination
TEXAS INSTRUMENTS INC7 citations82
US9324640B1Apr 26, 2016
Triple stack semiconductor package
TEXAS INSTRUMENTS INC8 citations82
US9184119B2Nov 10, 2015
Lead frame with abutment surface
TEXAS INSTRUMENTS INC5 citations80
US11056462B2Jul 6, 2021
Locking dual leadframe for flip chip on leadframe packages
TEXAS INSTRUMENTS INC2 citations71
US9691748B2Jun 27, 2017
Forming a panel of triple stack semiconductor packages
TEXAS INSTRUMENTS INC4 citations71
US11742263B2Aug 29, 2023
Flippable leadframe for packaged electronic system having vertically stacked chip and components
TEXAS INSTRUMENTS INC0 citations61
US9496206B2Nov 15, 2016
Flippable leadframe for packaged electronic system having vertically stacked chips and components
TEXAS INSTRUMENTS INC1 citations61
US9859197B2Jan 2, 2018
Integrated circuit package fabrication
TEXAS INSTRUMENTS INC1 citations59
US10515928B2Dec 24, 2019
Stacked semiconductor system having interposer of half-etched and molded sheet metal
TEXAS INSTRUMENTS INC1 citations55
US11348806B2May 31, 2022
Making a flat no-lead package with exposed electroplated side lead surfaces
TEXAS INSTRUMENTS INC0 citations53
US10879154B2Dec 29, 2020
Flippable leadframe for packaged electronic system having vertically stacked chips and components
TEXAS INSTRUMENTS INC0 citations51
US10804114B2Oct 13, 2020
Methods for making a multilevel leadframe by etching a conductive sheet from two opposite sides
TEXAS INSTRUMENTS INC0 citations51
US10541225B2Jan 21, 2020
Methods of assembling a flip chip on a locking dual leadframe
TEXAS INSTRUMENTS INC0 citations51
US9892936B2Feb 13, 2018
Packaged semiconductor device having leadframe features preventing delamination
TEXAS INSTRUMENTS INC1 citations51
US9842807B2Dec 12, 2017
Integrated circuit assembly
TEXAS INSTRUMENTS INC0 citations51
US9275983B2Mar 1, 2016
Integrated circuit package
TEXAS INSTRUMENTS INC0 citations49
US10720406B2Jul 21, 2020
Stacked semiconductor system having interposer of half-etched and molded sheet metal
TEXAS INSTRUMENTS INC0 citations44