Inventor
BIN ABDUL AZIZ ANIS FAUZI
MY22 patents
Patents
22 patentsUS9741643B2Aug 22, 2017
Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns
TEXAS INSTRUMENTS INC9 citations82
US9515009B2Dec 6, 2016
Packaged semiconductor device having leadframe features preventing delamination
TEXAS INSTRUMENTS INC7 citations82
US9324640B1Apr 26, 2016
Triple stack semiconductor package
TEXAS INSTRUMENTS INC8 citations82
US10784190B2Sep 22, 2020
Method of making leadframe strip
TEXAS INSTRUMENTS INC1 citations72
US10115660B2Oct 30, 2018
Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns
TEXAS INSTRUMENTS INC2 citations72
US11791170B2Oct 17, 2023
Universal semiconductor package molds
TEXAS INSTRUMENTS INC2 citations71
US11056462B2Jul 6, 2021
Locking dual leadframe for flip chip on leadframe packages
TEXAS INSTRUMENTS INC2 citations71
US9691748B2Jun 27, 2017
Forming a panel of triple stack semiconductor packages
TEXAS INSTRUMENTS INC4 citations71
US11264310B2Mar 1, 2022
Spring bar leadframe, method and packaged electronic device with zero draft angle
TEXAS INSTRUMENTS INC2 citations68
US11830791B2Nov 28, 2023
Leads for leadframe and semiconductor package
TEXAS INSTRUMENTS INC0 citations62
US11742263B2Aug 29, 2023
Flippable leadframe for packaged electronic system having vertically stacked chip and components
TEXAS INSTRUMENTS INC0 citations61
US11373940B2Jun 28, 2022
Method of making leadframe strip
TEXAS INSTRUMENTS INC0 citations61
US9496206B2Nov 15, 2016
Flippable leadframe for packaged electronic system having vertically stacked chips and components
TEXAS INSTRUMENTS INC1 citations61
US11626350B2Apr 11, 2023
Cutting a leadframe assembly with a plurality of punching tools
TEXAS INSTRUMENTS INC0 citations59
US12087674B2Sep 10, 2024
Spring bar leadframe, method and packaged electronic device with zero draft angle
TEXAS INSTRUMENTS INC0 citations58
US10879154B2Dec 29, 2020
Flippable leadframe for packaged electronic system having vertically stacked chips and components
TEXAS INSTRUMENTS INC0 citations51
US10541225B2Jan 21, 2020
Methods of assembling a flip chip on a locking dual leadframe
TEXAS INSTRUMENTS INC0 citations51
US9892936B2Feb 13, 2018
Packaged semiconductor device having leadframe features preventing delamination
TEXAS INSTRUMENTS INC1 citations51
US9842807B2Dec 12, 2017
Integrated circuit assembly
TEXAS INSTRUMENTS INC0 citations51
US11569154B2Jan 31, 2023
Interdigitated outward and inward bent leads for packaged electronic device
TEXAS INSTRUMENTS INC0 citations49
US11569152B2Jan 31, 2023
Electronic device with lead pitch gap
TEXAS INSTRUMENTS INC0 citations49
US9275983B2Mar 1, 2016
Integrated circuit package
TEXAS INSTRUMENTS INC0 citations49