Inventor
FEN SUEANN LIM WEI
MY8 patents
Patents
8 patentsUS9741643B2Aug 22, 2017
Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns
TEXAS INSTRUMENTS INC9 citations82
US9515009B2Dec 6, 2016
Packaged semiconductor device having leadframe features preventing delamination
TEXAS INSTRUMENTS INC7 citations82
US9324640B1Apr 26, 2016
Triple stack semiconductor package
TEXAS INSTRUMENTS INC8 citations82
US9013028B2Apr 21, 2015
Integrated circuit package and method of making
TEXAS INSTRUMENTS INC5 citations81
US9184119B2Nov 10, 2015
Lead frame with abutment surface
TEXAS INSTRUMENTS INC5 citations80
US9691748B2Jun 27, 2017
Forming a panel of triple stack semiconductor packages
TEXAS INSTRUMENTS INC4 citations71
US9496206B2Nov 15, 2016
Flippable leadframe for packaged electronic system having vertically stacked chips and components
TEXAS INSTRUMENTS INC1 citations61
US9859197B2Jan 2, 2018
Integrated circuit package fabrication
TEXAS INSTRUMENTS INC1 citations59