Inventor
RYU DONG SOO
KR10 patents
⚠️ This page may combine multiple inventors who share the name “RYU DONG SOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
5 patentsUS9916989B2Mar 13, 2018
System and method for laser assisted bonding of semiconductor die
AMKOR TECHNOLOGY INC11 citations90
US9859203B2Jan 2, 2018
Semiconductor package and fabricating method thereof
AMKOR TECHNOLOGY INC16 citations90
US10304698B2May 28, 2019
System and method for laser assisted bonding of semiconductor die
AMKOR TECHNOLOGY INC7 citations82
US10763129B2Sep 1, 2020
System and method for laser assisted bonding of an electronic device
AMKOR TECHNOLOGY INC3 citations71
US10586761B2Mar 10, 2020
Semiconductor package and fabricating method thereof
AMKOR TECHNOLOGY INC0 citations50
AMKOR TECH SINGAPORE HOLDING PTE LTD
5 patentsUS11961797B2Apr 16, 2024
Semiconductor package and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations71
US11121071B2Sep 14, 2021
Semiconductor package and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations71
US12388005B2Aug 12, 2025
Semiconductor package and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations60
US12374558B2Jul 29, 2025
Laser-assisted bonding apparatus for bonding an electronic device to a substrate
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations60
US11742216B2Aug 29, 2023
System and method for laser assisted bonding of an electronic device
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations60