Inventor
KANG DAE BYOUNG
KR15 patents
⚠️ This page may combine multiple inventors who share the name “KANG DAE BYOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
7 patentsUS7982298B1Jul 19, 2011
Package in package semiconductor device
AMKOR TECHNOLOGY INC56 citations96
US9859203B2Jan 2, 2018
Semiconductor package and fabricating method thereof
AMKOR TECHNOLOGY INC16 citations90
US10242956B1Mar 26, 2019
Semiconductor device with metal dam and fabricating method
AMKOR TECHNOLOGY INC6 citations82
US10037949B1Jul 31, 2018
Semiconductor package and fabricating method thereof
AMKOR TECHNOLOGY INC11 citations80
US6897550B1May 24, 2005
Fully-molded leadframe stand-off feature
AMKOR TECHNOLOGY INC14 citations78
US10811341B2Oct 20, 2020
Semiconductor device with through-mold via
AMKOR TECHNOLOGY INC1 citations61
US10586761B2Mar 10, 2020
Semiconductor package and fabricating method thereof
AMKOR TECHNOLOGY INC0 citations50
AMKOR TECH SINGAPORE HOLDING PTE LTD
5 patentsUS11961797B2Apr 16, 2024
Semiconductor package and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations71
US11121071B2Sep 14, 2021
Semiconductor package and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations71
US12494414B2Dec 9, 2025
Semiconductor device with through-mold via
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
US11869829B2Jan 9, 2024
Semiconductor device with through-mold via
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
US12388005B2Aug 12, 2025
Semiconductor package and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations60