Inventor
ROESNER MICHAEL
AT28 patents
⚠️ This page may combine multiple inventors who share the name “ROESNER MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
23 patentsUS9496193B1Nov 15, 2016
Semiconductor chip with structured sidewalls
INFINEON TECHNOLOGIES AG38 citations93
US9673096B2Jun 6, 2017
Method for processing a semiconductor substrate and a method for processing a semiconductor wafer
INFINEON TECHNOLOGIES AG22 citations91
US10032670B2Jul 24, 2018
Plasma dicing of silicon carbide
INFINEON TECHNOLOGIES AG6 citations73
US9610543B2Apr 4, 2017
Method for simultaneous structuring and chip singulation
INFINEON TECHNOLOGIES AG2 citations72
US9704748B2Jul 11, 2017
Method of dicing a wafer
INFINEON TECHNOLOGIES AG4 citations71
US11282805B2Mar 22, 2022
Silicon carbide devices and methods for manufacturing the same
INFINEON TECHNOLOGIES AG0 citations62
US11077525B2Aug 3, 2021
Method of processing a silicon carbide containing crystalline substrate, silicon carbide chip, and processing chamber
INFINEON TECHNOLOGIES AG0 citations62
US11063014B2Jul 13, 2021
Semiconductor devices including a metal silicide layer and methods for manufacturing thereof
INFINEON TECHNOLOGIES AG0 citations62
US11367654B2Jun 21, 2022
Component and method of manufacturing a component using an ultrathin carrier
INFINEON TECHNOLOGIES AG1 citations60
US11195713B2Dec 7, 2021
Methods of forming a silicon-insulator layer and semiconductor device having the same
INFINEON TECHNOLOGIES AG0 citations57
US9449876B2Sep 20, 2016
Singulation of semiconductor dies with contact metallization by electrical discharge machining
INFINEON TECHNOLOGIES AG0 citations52
US10672716B2Jun 2, 2020
Integrated circuit substrate and method for manufacturing the same
INFINEON TECHNOLOGIES AG0 citations51
US10622218B2Apr 14, 2020
Segmented edge protection shield
INFINEON TECHNOLOGIES AG0 citations51
US10020264B2Jul 10, 2018
Integrated circuit substrate and method for manufacturing the same
INFINEON TECHNOLOGIES AG0 citations51
US10005659B2Jun 26, 2018
Method for simultaneous structuring and chip singulation
INFINEON TECHNOLOGIES AG0 citations51
US9911686B2Mar 6, 2018
Source down semiconductor devices and methods of formation thereof
INFINEON TECHNOLOGIES AG0 citations51
US9793129B2Oct 17, 2017
Segmented edge protection shield
INFINEON TECHNOLOGIES AG0 citations51
US9455192B2Sep 27, 2016
Kerf preparation for backside metallization
INFINEON TECHNOLOGIES AG0 citations51
US9368436B2Jun 14, 2016
Source down semiconductor devices and methods of formation thereof
INFINEON TECHNOLOGIES AG1 citations51
US10157765B2Dec 18, 2018
Methods for processing a semiconductor workpiece
INFINEON TECHNOLOGIES AG1 citations48
US10643917B2May 5, 2020
Magnetic phase change material for heat dissipation
INFINEON TECHNOLOGIES AG0 citations43
US9059273B2Jun 16, 2015
Methods for processing a semiconductor wafer
INFINEON TECHNOLOGIES AG0 citations40
US9640419B2May 2, 2017
Carrier system for processing semiconductor substrates, and methods thereof
INFINEON TECHNOLOGIES AG0 citations39