Inventor
AHN JINCHAN
KR9 patents
Patents
9 patentsUS11037894B2Jun 15, 2021
Semiconductor device having metal bump and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US10714438B2Jul 14, 2020
Semiconductor device having metal bump and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US11869878B2Jan 9, 2024
Semiconductor module including a semiconductor package connected to a module substrate and a bonding wire
SAMSUNG ELECTRONICS CO LTD0 citations59
US11171119B2Nov 9, 2021
Semiconductor module including a semiconductor package connected to a module substrate and a bonding wire
SAMSUNG ELECTRONICS CO LTD0 citations59
US11894242B2Feb 6, 2024
Semiconductor package and method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations57
US11610786B2Mar 21, 2023
Semiconductor package and method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations57
US12154889B2Nov 26, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49
US10141255B2Nov 27, 2018
Circuit boards and semiconductor packages including the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US10002822B2Jun 19, 2018
Circuit boards and semiconductor packages including the same
SAMSUNG ELECTRONICS CO LTD0 citations49