Inventor

SUGANUMA KATSUAKI

JP32 patents

⚠️ This page may combine multiple inventors who share the name “SUGANUMA KATSUAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUGANUMA KATSUAKI

UNIV OSAKA

Transparent conductive ink and transparent conductive pattern forming method

Silver particle synthesizing method, silver particles, conductive paste producing method, and conductive paste

Bonding material, method for producing bonding material, and method for producing bonding structure

Substrate evaluation chip and substrate evaluation device

Bonding structure and method for producing bonding structure

Bonding member, method for producing bonding member and method for producing bonding structure

Bonding structure production method and bonding structure

Bonding device

Silver particle producing method, silver particles, and silver paste

Method for producing copper particles, copper particles, and copper paste

NICHIA CORP

Method for producing an electronic device

Method for producing an electronic device

Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device

Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device

SENJU METAL INDUSTRY CO

Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part

Solder alloy for power devices and solder joint having a high current density

Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part

NIPPON SHEET GLASS CO LTD

Lead-free solder alloy

Method of manufacturing glass panel and glasspanel manufactured by the method

DOWA MINING CO

Process for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic material

Electronic circuit substrates fabricated from an aluminum ceramic composite material

KURAMOTO MASAFUMI

Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device

Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, and light-emitting device

OSAKA IND PROMOTIONAL ORGANIZA

Silver β-ketocarboxylate, material comprising the same for forming silver metal, and use thereof

SHIMADZU CORP

Fiber-reinforced metal

SHOWA DENKO KK

Method for producing metal nanowires and silver nanowires

NOF CORP

Composition for forming copper pattern and method for forming copper pattern

NIPPON MEKTRON KK

Insulating material, passive element, circuit board, and method of manufacturing an insulating sheet

SHARP KK

Conductive paste having dilatancy, electrode connection structure including the paste, and method for producing the structure

SUGANUMA KATSUAKI

Semiconductor device and bonding material for semiconductor device

TSUJIMOTO MASANOBU

Method of surface treatment for the inhibition of whiskers

DAICEL CORP

Dispersion medium for metal particle sintering, and electroconductive paste