Inventor
JI YUN JE
KR9 patents
Patents
9 patentsUS11259404B2Feb 22, 2022
Rigid-flexible printed circuit board and electronic component module
SAMSUNG ELECTRO MECH2 citations71
US11172574B2Nov 9, 2021
Printed circuit board assembly
SAMSUNG ELECTRO MECH2 citations71
US11963311B2Apr 16, 2024
Printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations62
US12114428B2Oct 8, 2024
Electronic component embedded substrate
SAMSUNG ELECTRO MECH0 citations61
US11882652B2Jan 23, 2024
Printed circuit board
SAMSUNG ELECTRO MECH0 citations61
US11439020B2Sep 6, 2022
Electronic component-embedded substrate
SAMSUNG ELECTRO MECH0 citations61
US11315879B2Apr 26, 2022
Package substrate and multi-chip package including the same
SAMSUNG ELECTRO MECH0 citations61
US11206736B1Dec 21, 2021
Connection substrate and interposer substrate including the same
SAMSUNG ELECTRO MECH1 citations61
US11076485B2Jul 27, 2021
Component mounted board and electronic device comprising the same
SAMSUNG ELECTRO MECH1 citations61