Inventor
JANG AE-NEE
KR30 patents
⚠️ This page may combine multiple inventors who share the name “JANG AE-NEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
26 patentsUS11610785B2Mar 21, 2023
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD4 citations74
US11869775B2Jan 9, 2024
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD2 citations73
US11257793B2Feb 22, 2022
Semiconductor devices and methods for manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US11056414B2Jul 6, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations73
US10930602B2Feb 23, 2021
Semiconductor device and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US9859204B2Jan 2, 2018
Semiconductor devices with redistribution pads
SAMSUNG ELECTRONICS CO LTD2 citations72
US9024448B2May 5, 2015
Lower semiconductor molding die, semiconductor package, and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations72
US11769746B2Sep 26, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US11329032B2May 10, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations71
US10211176B2Feb 19, 2019
Semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations71
US11955399B2Apr 9, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11837577B2Dec 5, 2023
System-in-package module
SAMSUNG ELECTRONICS CO LTD0 citations62
US11830853B2Nov 28, 2023
Semiconductor devices and methods for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11784137B2Oct 10, 2023
Semiconductor device and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11664292B2May 30, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11398454B2Jul 26, 2022
System-in-package module
SAMSUNG ELECTRONICS CO LTD0 citations62
US11133232B2Sep 28, 2021
Semiconductor device, method of testing semiconductor device and method of manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations62
US9159705B2Oct 13, 2015
Semiconductor chip connecting semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations62
US11784171B2Oct 10, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations60
US10943881B2Mar 9, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US12374597B2Jul 29, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations54
US12002731B2Jun 4, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations54
US11948919B2Apr 2, 2024
Stacked semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US11158589B2Oct 26, 2021
Semiconductor device and semiconductor package comprising the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US9570423B2Feb 14, 2017
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations51
US11776866B2Oct 3, 2023
Semiconductor module heatspreading lid having integrated separators for multiple chips
SAMSUNG ELECTRONICS CO LTD0 citations50