Inventor

MURANAKA SEIJI

JP18 patents

⚠️ This page may combine multiple inventors who share the name “MURANAKA SEIJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MURANAKA SEIJI

RENESAS ELECTRONICS CORP

Semicondutor device with copper plugs having different resistance values

Semiconductor device with copper interconnections

Semiconductor device with an interconnection layer and method of manufacturing the same

Semiconductor device having interconnection structure and method of manufacturing the same

Method of manufacturing semiconductor device

Semiconductor device and manufacturing method for the same

Method of manufacturing semiconductor device including copper interconnections

Method for manufacturing a semiconductor device

Semiconductor device and manufacturing method thereof, and mounting method of semiconductor device

MITSUBISHI ELECTRIC CORP

Resist residue removal apparatus and method

Analyzing system of organic substance adhering to a surface of a sample

Method of fabricating semiconductor device and semiconductor device

Method and apparatus for removing contaminants from the surface of a semiconductor wafer

Resist peeling system and control method of a resist peeling solution

Method and apparatus for cleaning semiconductor device and method of fabricating semiconductor device

RENESAS TECH CORP

Semiconductor device, method of producing a semiconductor device, and semiconductor substrate cleaning apparatus used for the production method

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Substrate cleaning method and method for producing an electronic device

KAO CORP

Method of manufacturing semiconductor device with improved removal of resist residues