Inventor
YANG YEN-CHU
US8 patents
Patents
8 patentsUS11077536B2Aug 3, 2021
Slurry distribution device for chemical mechanical polishing
APPLIED MATERIALS INC2 citations71
US10967483B2Apr 6, 2021
Slurry distribution device for chemical mechanical polishing
APPLIED MATERIALS INC2 citations71
US11897079B2Feb 13, 2024
Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
APPLIED MATERIALS INC1 citations62
US11986926B2May 21, 2024
Slurry distribution device for chemical mechanical polishing
APPLIED MATERIALS INC0 citations61
US11806835B2Nov 7, 2023
Slurry distribution device for chemical mechanical polishing
APPLIED MATERIALS INC0 citations61
US12557343B2Feb 17, 2026
Method of ultra thinning of wafer
APPLIED MATERIALS INC0 citations60
US12495582B2Dec 9, 2025
Self-aligned wide backside power rail contacts to multiple transistor sources
APPLIED MATERIALS INC0 citations60
US12214468B2Feb 4, 2025
Temperature control of chemical mechanical polishing
APPLIED MATERIALS INC0 citations50