Inventor
TAN TERRENCE HUAT HIN
MY5 patents
⚠️ This page may combine multiple inventors who share the name “TAN TERRENCE HUAT HIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
4 patentsUS11257560B2Feb 22, 2022
Test architecture for die to die interconnect for three dimensional integrated circuits
INTEL CORP1 citations55
US10139445B2Nov 27, 2018
High speed I/O pinless structural testing
INTEL CORP0 citations42
US11476168B2Oct 18, 2022
Die stack override for die testing
INTEL CORP0 citations36
US10236076B2Mar 19, 2019
Methods and apparatus for predictable protocol aware testing on memory interface
INTEL CORP0 citations31