Inventor

BOTHE KYLE

US22 patents

⚠️ This page may combine multiple inventors who share the name “BOTHE KYLE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BOTHE KYLE

WOLFSPEED INC

Radio frequency transistor amplifiers having widened and/or asymmetric source/drain regions for improved on-resistance performance

Field effect transistor with source-connected field plate

Field effect transistor with enhanced reliability

Transistor with ohmic contacts

Packaged electronic circuits having moisture protection encapsulation and methods of forming same

Field effect transistor with at least partially recessed field plate

Field reducing structures for nitrogen-polar group III-nitride semiconductor devices

Method for reducing parasitic capacitance and increasing peak transconductance while maintaining on-state resistance and related devices

High electron mobility transistors and power amplifiers including said transistors having improved performance and reliability

Radio frequency transistor amplifiers having self-aligned double implanted source/drain regions for improved on-resistance performance and related methods

Methods of manufacturing high electron mobility transistors having a modified interface region

Field effect transistor with multiple stepped field plate

Semiconductor device incorporating a substrate recess

MACOM TECH SOLUTIONS HOLDINGS INC

Plasma-based barrier layer removal method for increasing peak transconductance while maintaining on-state resistance and related devices

Transistors including semiconductor surface modification and related fabrication methods

High electron mobility transistors having improved performance

Field effect transistor with stacked unit subcell structure

High electron mobility transistors having reduced drain current drift and methods of fabricating such devices

CREE INC

High electron mobility transistors and power amplifiers including said transistors having improved performance and reliability

High electron mobility transistors having improved contact spacing and/or improved contact vias

Packaged electronic circuits having moisture protection encapsulation and methods of forming same

Encapsulation stack for improved humidity performance and related fabrication methods