Inventor
KRISHNAPURA LAKSHMINARASIMHA
US20 patents
⚠️ This page may combine multiple inventors who share the name “KRISHNAPURA LAKSHMINARASIMHA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICON BANDWIDTH INC
13 patentsUS6307258B1Oct 23, 2001
Open-cavity semiconductor die package
SILICON BANDWIDTH INC38 citations96
US6461197B2Oct 8, 2002
Female contact pin including flexible contact portion
SILICON BANDWIDTH INC47 citations95
US6334794B1Jan 1, 2002
Electrical connector having staggered hold-down tabs
SILICON BANDWIDTH INC26 citations92
US6305987B1Oct 23, 2001
Integrated connector and semiconductor die package
SILICON BANDWIDTH INC32 citations92
US6247972B1Jun 19, 2001
Electrical connector assembly with a female electrical connector having internal flexible contact arm
SILICON BANDWIDTH INC17 citations92
US6078102AJun 20, 2000
Semiconductor die package for mounting in horizontal and upright configurations
SILICON BANDWIDTH INC34 citations92
US6421254B2Jul 16, 2002
Multi-chip module having interconnect dies
SILICON BANDWIDTH INC19 citations91
US6475832B2Nov 5, 2002
Open-cavity semiconductor die package
SILICON BANDWIDTH INC5 citations74
US6679733B2Jan 20, 2004
Electrical connector having electrically conductive shielding
SILICON BANDWIDTH INC9 citations73
US6266246B1Jul 24, 2001
Multi-chip module having interconnect dies
SILICON BANDWIDTH INC9 citations72
US6857173B1Feb 22, 2005
Apparatus for and method of manufacturing a semiconductor die carrier
SILICON BANDWIDTH INC9 citations71
US6141869ANov 7, 2000
Apparatus for and method of manufacturing a semiconductor die carrier
SILICON BANDWIDTH INC8 citations71
US6709891B2Mar 23, 2004
Open-cavity semiconductor die package
SILICON BANDWIDTH INC5 citations68
PANDA PROJECT
4 patentsUS6016256AJan 18, 2000
Multi-chip module having interconnect dies
PANDA PROJECT44 citations94
US6050850AApr 18, 2000
Electrical connector having staggered hold-down tabs
PANDA PROJECT30 citations92
US6031720AFeb 29, 2000
Cooling system for semiconductor die carrier
PANDA PROJECT47 citations91
US5951665ASep 14, 1999
Interface optimized computer system architecture
PANDA PROJECT34 citations89