Inventor

YAP LIOP-JIN

SG8 patents

⚠️ This page may combine multiple inventors who share the name “YAP LIOP-JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ST ASSEMBLY TEST SERVICES PTE

4 patents

US6404212B1Jun 11, 2002

Testing of BGA and other CSP packages using probing techniques

ST ASSEMBLY TEST SERVICES PTE17 citations91

US6300781B1Oct 9, 2001

Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system

ST ASSEMBLY TEST SERVICES PTE23 citations89

US6791346B2Sep 14, 2004

Testing of BGA and other CSP packages using probing techniques

ST ASSEMBLY TEST SERVICES PTE8 citations72

US7076861B2Jul 18, 2006

Multi-package conversion kit for a pick and place handler

ST ASSEMBLY TEST SERVICES PTE1 citations42

ST ASSEMBLY TEST SERVICES LTD

1 patent

US6586925B2Jul 1, 2003

Method and apparatus for establishing quick and reliable connection between a semiconductor device handler plate and a semiconductor device test head plate

ST ASSEMBLY TEST SERVICES LTD28 citations88

ST ASSEMBLY TEST SERVICES

1 patent

US6242933B1Jun 5, 2001

Device probe socket forming part of a test head, interfacing between test head and a probe handler, used for device strip testing

ST ASSEMBLY TEST SERVICES37 citations87

ST ASSEMBLY TEST SERVICE LTD

1 patent

US6535004B2Mar 18, 2003

Testing of BGA and other CSP packages using probing techniques

ST ASSEMBLY TEST SERVICE LTD12 citations72

ST ASSEMBY TEST SERVICES PTE L

1 patent

US6433564B1Aug 13, 2002

BGA device positioner kit

ST ASSEMBY TEST SERVICES PTE L6 citations54