Inventor
CAMENFORTE RAYMUNDO M
SG17 patents
⚠️ This page may combine multiple inventors who share the name “CAMENFORTE RAYMUNDO M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLE INC
5 patentsUS11728266B2Aug 15, 2023
Die stitching and harvesting of arrayed structures
APPLE INC6 citations86
US12074077B2Aug 27, 2024
Flexible package architecture concept in fanout
APPLE INC2 citations70
US11395408B2Jul 19, 2022
Wafer-level passive array packaging
APPLE INC2 citations70
US12588494B2Mar 24, 2026
Die stitching and harvesting of arrayed structures
APPLE INC0 citations62
US12165956B2Dec 10, 2024
Molded silicon on passive package
APPLE INC0 citations59
ST ASSEMBLY TEST SERVICES PTE
4 patentsUS6355199B1Mar 12, 2002
Method of molding flexible circuit with molded stiffener
ST ASSEMBLY TEST SERVICES PTE35 citations92
US6404212B1Jun 11, 2002
Testing of BGA and other CSP packages using probing techniques
ST ASSEMBLY TEST SERVICES PTE17 citations91
US6103550AAug 15, 2000
Molded tape support for a molded circuit package prior to dicing
ST ASSEMBLY TEST SERVICES PTE13 citations73
US6791346B2Sep 14, 2004
Testing of BGA and other CSP packages using probing techniques
ST ASSEMBLY TEST SERVICES PTE8 citations72
ST ASSEMBLY TEST SERVICES LTD
3 patentsUS6537848B2Mar 25, 2003
Super thin/super thermal ball grid array package
ST ASSEMBLY TEST SERVICES LTD79 citations98
US6759752B2Jul 6, 2004
Single unit automated assembly of flex enhanced ball grid array packages
ST ASSEMBLY TEST SERVICES LTD8 citations73
US6617525B2Sep 9, 2003
Molded stiffener for flexible circuit molding
ST ASSEMBLY TEST SERVICES LTD6 citations73