Inventor
GORMLEY COLIN STEPHEN
IE7 patents
Patents
7 patentsUS7122416B2Oct 17, 2006
Method for forming a filled trench in a semiconductor layer of a semiconductor substrate, and a semiconductor substrate with a semiconductor layer having a filled trench therein
ANALOG DEVICES INC13 citations81
US7531842B2May 12, 2009
Method for etching a tapered bore in a silicon substrate, and a semiconductor wafer comprising the substrate
ANALOG DEVICES INC8 citations80
US6818564B1Nov 16, 2004
Method for etching a tapered bore in a silicon substrate, and a semiconductor wafer comprising the substrate
ANALOG DEVICES INC17 citations80
US6797591B1Sep 28, 2004
Method for forming a semiconductor device and a semiconductor device formed by the method
ANALOG DEVICES INC2 citations55
US7045869B2May 16, 2006
Semiconductor wafer comprising micro-machined components
ANALOG DEVICES INC0 citations44
US6723579B2Apr 20, 2004
Semiconductor wafer comprising micro-machined components and a method for fabricating the semiconductor wafer
ANALOG DEVICES INC0 citations44
US7041528B2May 9, 2006
Method for forming a micro-mechanical component in a semiconductor wafer, and a semiconductor wafer comprising a micro-mechanical component formed therein
ANALOG DEVICES INC0 citations39