Inventor

LIU JOYCE C

US18 patents

⚠️ This page may combine multiple inventors who share the name “LIU JOYCE C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU JOYCE C

IBM

Slurry for mechanical polishing (CMP) of metals and use thereof

Protective hardmask for producing interconnect structures

Method for reducing line edge roughness of oxide material using chemical oxide removal

Method for improving adhesion to copper

Method for improving adhesion to copper

Method for uniform reactive ion etching of dual pre-doped polysilicon regions

Dual layer hard mask for eDRAM gate etch process

Dual mask process for semiconductor devices

Method of forming active devices of different gatelengths using lithographic printed gate images of same length

Reduced dielectric constant spacer materials integration for high speed logic gates

Structure and method for manufacturing trench capacitance

Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures

Method of producing heat dissipating structure for semiconductor devices

GLOBALFOUNDRIES INC

Strain engineering devices using partial depth films in through-substrate vias

Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability

Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability

Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures

Forming edge etch protection using dual layer of positive-negative tone resists