Inventor

KIM JONGHAE

US245 patents

⚠️ This page may combine multiple inventors who share the name “KIM JONGHAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM JONGHAE

QUALCOMM INC

Density-optimized module-level inductor ground structure

Varying thickness inductor

Forming radio frequency integrated circuits

Three-dimensional (3D) integrated circuit device having a backside power delivery network

Capacitor interposer layer (CIL) in a die-to-wafer three-dimensional (3D) integrated circuit (IC) (3DIC)

Three-dimensional high quality passive structure with conductive pillar technology

Skewed co-spiral inductor structure

Compartment shielding in flip-chip (FC) module

Vertical-coupling transformer with an air-gap structure

Passive-on-glass (POG) device and method

Backside coupled symmetric varactor structure

Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)

Backside coupled symmetric varactor structure

Hybrid transformer structure on semiconductor devices

High pass filters and low pass filters using through glass via technology

Package on package (PoP) integrated device comprising a capacitor in a substrate

Low package parasitic inductance using a thru-substrate interposer

Two-stage power delivery architecture

Through via inductor or transformer in a high-resistance substrate with programmability

Accessing a multi-channel memory system having non-uniform page sizes

Partitioning a crossbar interconnect in a multi-channel memory system

Techniques for placement of active and passive devices within a chip

Backside drill embedded die substrate

Inductor with metal-insulator-metal (MIM) capacitor

Diplexer design using through glass via technology

IBM

System and method for monitoring reliability of a digital system

Apparatus and method for micro performance tuning of a clocked digital system

Passive components in the back end of integrated circuits

High yield, high density on-chip capacitor design

Method and system for testing processor cores

Method and systems for copying data components between nodes of a wireless sensor network

Structure for symmetrical capacitor

Random number generator with random sampling

High yield, high density on-chip capacitor design

Independent processor voltage supply

Structure for symmetrical capacitor

Circuit structures and methods with BEOL layer(s) configured to block electromagnetic interference

KIM JONGHAE

Apparatus and method for through silicon via impedance matching

Location tracking of mobile phone using GPS function

Three dimensional inductor and transformer

Techniques for placement of active and passive devices within a chip

SAMSUNG ELECTRONICS CO LTD

Electronic device including flexible display

Rotary device and electronic device having the same

Head-mounted display apparatus

QUALCOMM MEMS TECHNOLOGIES INC

Incorporation of passives and fine pitch through via for package on package

Three-dimensional multilayer solenoid transformer

Selective tuning of acoustic devices

ZUO CHENGJIE

Piezoelectric laterally vibrating resonator structure geometries for spurious frequency suppression

WANG FENG

Load balancing scheme in multiple channel DRAM systems

LO CHI SHUN

Three-dimensional multilayer solenoid transformer