Inventor

YUN CHANGHAN HOBIE

US102 patents

⚠️ This page may combine multiple inventors who share the name “YUN CHANGHAN HOBIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YUN CHANGHAN HOBIE

QUALCOMM INC

Density-optimized module-level inductor ground structure

Varying thickness inductor

Three-dimensional high quality passive structure with conductive pillar technology

Skewed co-spiral inductor structure

Compartment shielding in flip-chip (FC) module

Passive-on-glass (POG) device and method

Backside coupled symmetric varactor structure

Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)

Backside coupled symmetric varactor structure

High pass filters and low pass filters using through glass via technology

Low package parasitic inductance using a thru-substrate interposer

Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages

Inductor with metal-insulator-metal (MIM) capacitor

Substrate comprising an embedded inductor and a thin film magnetic core

Interposer device including at least one transistor and at least one through-substrate via

Backside ground plane for integrated circuit

Encapsulation of acoustic resonator devices

Nested through glass via transformer

Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications

Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications

Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter

Passive device assembly for accurate ground plane control

MIM capacitor and method of making the same

Integrated circuits (ICS) on a glass substrate

Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits

Varactor device with backside contact

3D pillar inductor

Stiffener with embedded passive components

Superposed structure 3D orthogonal through substrate inductor

Close proximity tunable inductive elements

Capacitance fine tuning by fin capacitor design

Frequency multiplexer

Package comprising an acoustic device and a polymer cap layer

Integration of through glass via (TGV) filter and acoustic filter

Wideband filter with resonators and inductors

Wideband filter with resonators and inductors

Hybrid passive-on-glass (POG) acoustic filter

3D pillar inductor

Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductor

Stacked substrate inductor

Embedded sheet capacitor

Stacked inductor having a discrete metal-stack pattern

Integrated circuits (ICs) on a glass substrate

Solenoid structure with conductive pillar technology

Thermal design and electrical routing for multiple stacked packages using through via insert (TVI)

QUALCOMM MEMS TECHNOLOGIES INC

Three-dimensional multilayer solenoid transformer

Selective tuning of acoustic devices

Compact 3-D coplanar transmission lines

LO CHI SHUN

Three-dimensional multilayer solenoid transformer

Complex passive design with special via implementation