P

Inventor

DUTTA RANADEEP

US39 patents
⚠️ This page may combine multiple inventors who share the name “DUTTA RANADEEP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

QUALCOMM INC

33 patents
US11984874B2May 14, 2024

Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods

QUALCOMM INC2 citations73
US11393789B2Jul 19, 2022

Stacked circuits of III-V devices over silicon with high quality integrated passives with hybrid bonding

QUALCOMM INC2 citations73
US11336251B2May 17, 2022

Device with 3D inductor and magnetic core in substrate

QUALCOMM INC2 citations73
US10546852B2Jan 28, 2020

Integrated semiconductor devices and method of fabricating the same

QUALCOMM INC3 citations73
US9252147B2Feb 2, 2016

Methods and apparatuses for forming multiple radio frequency (RF) components associated with different RF bands on a chip

QUALCOMM INC3 citations73
US9153691B1Oct 6, 2015

High voltage MOS transistor

QUALCOMM INC5 citations73
US11355617B2Jun 7, 2022

Self-aligned collector heterojunction bipolar transistor (HBT)

QUALCOMM INC4 citations72
US10340289B2Jul 2, 2019

Cascode radio frequency (RF) power amplifier on single diffusion

QUALCOMM INC3 citations67
US12334903B2Jun 17, 2025

Substrate comprising acoustic resonators configured as at least one acoustic filter

QUALCOMM INC1 citations64
US12512593B2Dec 30, 2025

Antenna module as a radio-frequency (RF) integrated circuit (IC) die with an integrated antenna substrate, and related fabrication methods

QUALCOMM INC0 citations62
US12283607B2Apr 22, 2025

3D inductor design using bundle substrate vias

QUALCOMM INC0 citations62
US12046530B2Jul 23, 2024

Thermal bridge interposer structure

QUALCOMM INC1 citations62
US11791226B2Oct 17, 2023

Device on ceramic substrate

QUALCOMM INC0 citations62
US11626236B2Apr 11, 2023

Stacked inductor having a discrete metal-stack pattern

QUALCOMM INC0 citations62
US11437367B2Sep 6, 2022

Heterogeneous integrated wideband high electron mobility transistor power amplifier with a single-crystal acoustic resonator/filter

QUALCOMM INC0 citations62
US11404345B2Aug 2, 2022

Advanced integrated passive device (IPD) with thin-film heat spreader (TF-HS) layer for high power handling filters in transmit (TX) path

QUALCOMM INC0 citations62
US11394360B2Jul 19, 2022

Resonator device

QUALCOMM INC0 citations62
US11380678B2Jul 5, 2022

Metamorphic high electron mobility transistor-heterojunction bipolar transistor integration

QUALCOMM INC0 citations62
US11152272B2Oct 19, 2021

Die-to-wafer hybrid bonding with forming glass

QUALCOMM INC0 citations62
US10950721B2Mar 16, 2021

Self-aligned high voltage transistor

QUALCOMM INC0 citations62
US12581956B2Mar 17, 2026

Through molding contact enabled EMI shielding

QUALCOMM INC0 citations52
US12424518B2Sep 23, 2025

Capacitor embedded 3D resonator for broadband filter

QUALCOMM INC0 citations52
US12401326B2Aug 26, 2025

Reducing parasitic capacitance

QUALCOMM INC0 citations52
US12255381B2Mar 18, 2025

Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methods

QUALCOMM INC0 citations52
US11862367B2Jan 2, 2024

ESL-less AC resistor for high frequency applications

QUALCOMM INC0 citations52
US11749746B2Sep 5, 2023

Radio frequency front end (RFFE) hetero-integration

QUALCOMM INC0 citations52
US11689181B2Jun 27, 2023

Package comprising stacked filters with a shared substrate cap

QUALCOMM INC0 citations52
US11652064B2May 16, 2023

Integrated device with electromagnetic shield

QUALCOMM INC0 citations52
US11605620B2Mar 14, 2023

Three-dimensional (3D) integrated circuit with passive elements formed by hybrid bonding

QUALCOMM INC0 citations52
US11024728B2Jun 1, 2021

Monolithic self-aligned heterojunction bipolar transistor (HBT) and complementary metal-oxide-semiconductor (CMOS)

QUALCOMM INC0 citations52
US10707352B2Jul 7, 2020

Transistor with lightly doped drain (LDD) compensation implant

QUALCOMM INC0 citations52
US10158030B2Dec 18, 2018

CMOS and bipolar device integration including a tunable capacitor

QUALCOMM INC1 citations52
US10748891B1Aug 18, 2020

Electrostatic discharge (ESD) robust transistor

QUALCOMM INC0 citations41

INT RECTIFIER CORP

4 patents

LEGERITY INC

2 patents