Inventor
DUTTA RANADEEP
US39 patents
⚠️ This page may combine multiple inventors who share the name “DUTTA RANADEEP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
33 patentsUS11984874B2May 14, 2024
Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods
QUALCOMM INC2 citations73
US11393789B2Jul 19, 2022
Stacked circuits of III-V devices over silicon with high quality integrated passives with hybrid bonding
QUALCOMM INC2 citations73
US11336251B2May 17, 2022
Device with 3D inductor and magnetic core in substrate
QUALCOMM INC2 citations73
US10546852B2Jan 28, 2020
Integrated semiconductor devices and method of fabricating the same
QUALCOMM INC3 citations73
US9252147B2Feb 2, 2016
Methods and apparatuses for forming multiple radio frequency (RF) components associated with different RF bands on a chip
QUALCOMM INC3 citations73
US9153691B1Oct 6, 2015
High voltage MOS transistor
QUALCOMM INC5 citations73
US11355617B2Jun 7, 2022
Self-aligned collector heterojunction bipolar transistor (HBT)
QUALCOMM INC4 citations72
US10340289B2Jul 2, 2019
Cascode radio frequency (RF) power amplifier on single diffusion
QUALCOMM INC3 citations67
US12334903B2Jun 17, 2025
Substrate comprising acoustic resonators configured as at least one acoustic filter
QUALCOMM INC1 citations64
US12512593B2Dec 30, 2025
Antenna module as a radio-frequency (RF) integrated circuit (IC) die with an integrated antenna substrate, and related fabrication methods
QUALCOMM INC0 citations62
US12283607B2Apr 22, 2025
3D inductor design using bundle substrate vias
QUALCOMM INC0 citations62
US12046530B2Jul 23, 2024
Thermal bridge interposer structure
QUALCOMM INC1 citations62
US11791226B2Oct 17, 2023
Device on ceramic substrate
QUALCOMM INC0 citations62
US11626236B2Apr 11, 2023
Stacked inductor having a discrete metal-stack pattern
QUALCOMM INC0 citations62
US11437367B2Sep 6, 2022
Heterogeneous integrated wideband high electron mobility transistor power amplifier with a single-crystal acoustic resonator/filter
QUALCOMM INC0 citations62
US11404345B2Aug 2, 2022
Advanced integrated passive device (IPD) with thin-film heat spreader (TF-HS) layer for high power handling filters in transmit (TX) path
QUALCOMM INC0 citations62
US11394360B2Jul 19, 2022
Resonator device
QUALCOMM INC0 citations62
US11380678B2Jul 5, 2022
Metamorphic high electron mobility transistor-heterojunction bipolar transistor integration
QUALCOMM INC0 citations62
US11152272B2Oct 19, 2021
Die-to-wafer hybrid bonding with forming glass
QUALCOMM INC0 citations62
US10950721B2Mar 16, 2021
Self-aligned high voltage transistor
QUALCOMM INC0 citations62
US12581956B2Mar 17, 2026
Through molding contact enabled EMI shielding
QUALCOMM INC0 citations52
US12424518B2Sep 23, 2025
Capacitor embedded 3D resonator for broadband filter
QUALCOMM INC0 citations52
US12401326B2Aug 26, 2025
Reducing parasitic capacitance
QUALCOMM INC0 citations52
US12255381B2Mar 18, 2025
Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methods
QUALCOMM INC0 citations52
US11862367B2Jan 2, 2024
ESL-less AC resistor for high frequency applications
QUALCOMM INC0 citations52
US11749746B2Sep 5, 2023
Radio frequency front end (RFFE) hetero-integration
QUALCOMM INC0 citations52
US11689181B2Jun 27, 2023
Package comprising stacked filters with a shared substrate cap
QUALCOMM INC0 citations52
US11652064B2May 16, 2023
Integrated device with electromagnetic shield
QUALCOMM INC0 citations52
US11605620B2Mar 14, 2023
Three-dimensional (3D) integrated circuit with passive elements formed by hybrid bonding
QUALCOMM INC0 citations52
US11024728B2Jun 1, 2021
Monolithic self-aligned heterojunction bipolar transistor (HBT) and complementary metal-oxide-semiconductor (CMOS)
QUALCOMM INC0 citations52
US10707352B2Jul 7, 2020
Transistor with lightly doped drain (LDD) compensation implant
QUALCOMM INC0 citations52
US10158030B2Dec 18, 2018
CMOS and bipolar device integration including a tunable capacitor
QUALCOMM INC1 citations52
US10748891B1Aug 18, 2020
Electrostatic discharge (ESD) robust transistor
QUALCOMM INC0 citations41
INT RECTIFIER CORP
4 patentsUS6441455B1Aug 27, 2002
Low dosage field rings for high voltage semiconductor device
INT RECTIFIER CORP31 citations92
US6627961B1Sep 30, 2003
Hybrid IGBT and MOSFET for zero current at zero voltage
INT RECTIFIER CORP18 citations84
US7005702B1Feb 28, 2006
IGBT with amorphous silicon transparent collector
INT RECTIFIER CORP4 citations61
US7507608B2Mar 24, 2009
IGBT with amorphous silicon transparent collector
INT RECTIFIER CORP0 citations51