Inventor
SENOO HIDEO
JP19 patents
Patents
19 patentsUS6544371B2Apr 8, 2003
Method of using a transfer tape
LINTEC CORP101 citations97
US6558975B2May 6, 2003
Process for producing semiconductor device
LINTEC CORP73 citations96
US6277481B1Aug 21, 2001
Adhesive composition and adhesive sheet
LINTEC CORP74 citations96
US5705016AJan 6, 1998
Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet
LINTEC CORP98 citations95
US5888606AMar 30, 1999
Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet
LINTEC CORP49 citations93
US6919262B2Jul 19, 2005
Process for producing semiconductor chips
LINTEC CORP38 citations92
US6765289B2Jul 20, 2004
Reinforcement material for silicon wafer and process for producing IC chip using said material
LINTEC CORP27 citations92
US6656819B1Dec 2, 2003
Process for producing semiconductor device
LINTEC CORP42 citations92
US6444310B1Sep 3, 2002
Dicing tape and a method of dicing a semiconductor wafer
LINTEC CORP45 citations92
US6297076B1Oct 2, 2001
Process for preparing a semiconductor wafer
LINTEC CORP25 citations92
US6042922AMar 28, 2000
Adhesive sheet for wafer setting and process for producing electronic component
LINTEC CORP37 citations91
US7135224B2Nov 14, 2006
Adhesive tape
LINTEC CORP21 citations89
US7384676B2Jun 10, 2008
Coating composition, hard coat film, and optical disk
LINTEC CORP10 citations83
US7408259B2Aug 5, 2008
Sheet to form a protective film for chips
LINTEC CORP4 citations74
US7235465B2Jun 26, 2007
Process for producing semiconductor chips having a protective film on the back surface
LINTEC CORP6 citations74
US7169648B2Jan 30, 2007
Process for producing a semiconductor device
LINTEC CORP8 citations74
US6855418B2Feb 15, 2005
Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same
LINTEC CORP8 citations74
US7589130B2Sep 15, 2009
Coating composition, coating film, method of manufacturing coating film, and optical recording medium
LINTEC CORP1 citations51
US7361971B2Apr 22, 2008
Semiconductor wafer protection structure and laminated protective sheet for use therein
LINTEC CORP1 citations51